关键词: 测试插座, 焊球外观, 无针式设计

Abstract: Abnormal appearances of circuit solder balls may occur during BGA packaging circuit testing using commonly used test sockets. In order to solve the problem of abnormal appearance, a new type of test socket is designed and realized based on the commonly used test sockets.Commonly used test sockets have a spring-loaded needle-type contact structure, while the new test sockets adopt a needle-free design for the contact parts.The effects of two types of sockets on the appearances of solder balls in BGA packaging circuits at different temperatures and operating voltages are verified through experiments, and the results are observed through a microscope.The results show that the optimized design of the socket can significantly reduce the impact on the appearancesof solder balls in the BGA packaging circuitsduring the test process, and at the same time, different temperatures and operating voltages do not have a significant impact on the appearancesof solder balls in BGA packaging circuits.

Key words: test socket, appearances of solder balls, needle-free design