中低温Sn-In-Bi-(Ag, Cu)焊料成分设计及可靠性研究*

doi:10.16257/j.cnki.1681-1070.2025.0093

摘要/Abstract

摘要： 在较高的焊接温度下芯片和基板变形量大，导致枕头效应（HoP）、虚焊(NWO)、桥接（SBB）等焊接缺陷突出，SAC305等常规中高温焊料已不能适用于大尺寸芯片焊接工艺要求，而低熔点SnBi基焊料可靠性尚有不足。为了解决熔点与可靠性的矛盾，通过In、Bi的加入降低了Sn-Ag-Cu焊料的熔点，其合金组织中并未形成低熔点相，同时根据焊点回流和高温老化的组织演变、抗跌落、高温老化、热疲劳等可靠性评价优化了Ag的含量。结果表明，相比SAC305，新型中低温Sn-In-Bi-(Ag，Cu)焊料的回流温度可降低20~25 ℃，基体强化的同时金属间化合物颗粒相的粗化得到抑制，其焊点可靠性也更优异。

关键词: 中低温焊料, Sn-In-Bi-(Ag, Cu)五元合金, 熔点, 可靠性, 金属间化合物

Abstract: The significant deformation of chips and substrates at elevated soldering temperatures leads to prominent soldering defects such as head-on-pillow (HoP), non-wet- open (NWO), and solder ball bridging (SBB). Traditional medium and high temperature solders, like SAC305, are no longer suitable for large-scale chip soldering processes, while the reliability of low melting point Sn-Bi solder remains unsatisfactory. In order to resolve the conflict between melting point and reliability, the melting point of Sn-Ag-Cu solder is reduced by adding In and Bi without forming low-melting-point phases in the alloy structure. Concurrently, the Ag content is optimized based on reliability evaluations encompassing solder joint reflow and high-temperature ageing microstructural evolution, drop resistance, high-temperature ageing, and thermal fatigue. The results indicate that compared to SAC305, the reflow temperature of the innovative medium-low temperature Sn-In-Bi-(Ag, Cu) solder can be reduced by 20-25 ℃. The enhancement of matrix strength is accompanied by the suppression of coarsening of intermetallic compound particles, thereby ensuring superior joint reliability in comparison with that of the SAC305 alloy.

Key words: medium and low temperature solder, Sn-In-Bi-(Ag, Cu) five-element alloy, melting point, reliability, intermetallic compound

中图分类号:

TG425⁺.1

梁泽，蒋少强，王剑，王世堉，聂富刚，张耀，周健. 中低温Sn-In-Bi-(Ag, Cu)焊料成分设计及可靠性研究^*[J]. 电子与封装, 2025, 25(9): 090202 .

LIANG Ze, JIANG Shaoqiang, WANG Jian, WANG Shiyu, NIE Fugang, ZHANG Yao, ZHOU Jian. Composition Design and Reliability Study of Medium and Low Temperature Sn-In-Bi-(Ag, Cu) Solders[J]. Electronics & Packaging, 2025, 25(9): 090202 .

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中国半导体行业协会封装分会会刊

中国电子学会电子制造与封装技术分会会刊

中低温Sn-In-Bi-(Ag, Cu)焊料成分设计及可靠性研究^*

Composition Design and Reliability Study of Medium and Low Temperature Sn-In-Bi-(Ag, Cu) Solders

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