关键词: DDR3, 高速电路, SiP, 信号完整性, Sigrity仿真

Abstract: Based on the system in package (SiP for short) technology. Combined with a self-developed independent controllable DSP processor (“HX” II-A) and multi-chip DDR3 particles. Moreover, this paper introduces in detail the design scheme and simulation verification analysis of a device result, a kind of high-speed dynamic memory control integrated SiP. The paper focuses on the circuit topology design and the layout design of this SiP, then it verifies its PCB post-simulation from three aspects, including topology simulation waveform, DDR3 timing margin calculation, and comparison with board-level implementation schemes. Finaly, the simulation results are compounded and standardized, and the requirements prove that the adopted Fly-By topology is suitable for integrated SiP equipment which is composed of CPU and multiple DDR3 particles. In addition, the performance of SiP equipment is better than the board-level implementation scheme.

Key words: DDR3, high-speedcircuit, SiP, signalintegrity, Sigritysimulation