芯片返修回流焊可靠性改善研究进展

doi:10.16257/j.cnki.1681-1070.2022.0812

摘要/Abstract

摘要： 在微电子产品的研发过程中，由于技术要求变更或故障维修等需求，需要对已焊接完成的电路板进行芯片的返修操作，而返修过程所涉及的高温时效和多次回流必然会对芯片本身及元器件造成损坏，因此需要通过相关过程可靠性研究指导具体的返修技术。通过分析国内外研究者对于芯片返修可靠性的研究，发现高温时效与多次回流均会使得焊点界面化合物形貌及微结构发生改变，但回流次数对焊点力学性能影响较小。另外，合适的镀层、焊盘或焊球尺寸都能够改善高温时效及多次回流产生的负面影响。

关键词: 芯片返修, 可靠性, 高温时效, 多次回流焊

Abstract: During the development of microelectronic products, due to the change of technical requirements or fault maintenance and other requirements, it is necessary to rework the chip on the soldered circuit board, and the high-temperature aging and multiple reflow involved in the rework process will inevitably damage the chip itself and components. Therefore, the guidance of specific repair technology through relevant process reliability research is in urgent need. By analyzing the research on chip rework reliability by researchers at home and abroad, it is found that high temperature aging and multiple reflow will change the morphology and microstructure of the solder joint intermetallic compounds, but the reflow times have little influence on the mechanical properties of the solder joint. In addition, appropriate plating, pad or ball size can ameliorate the negative effects of high temperature aging and multiple reflow.

Key words: chip rework, reliability, high-temperature aging, multiple reflow soldering

中图分类号:

TN306

刘少红；谭淇. 芯片返修回流焊可靠性改善研究进展[J]. 电子与封装, 2022, 22(8): 080206 .

LIU Shaohong, TAN Qi. Research Progress of Reliability Improvement of Reflow Soldering in Chip Rework[J]. Electronics & Packaging, 2022, 22(8): 080206 .

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