关键词: 焊点开裂, 有限元分析, 失效分析

Abstract: With the development of science and technology, the demand for miniaturization, high performance, lightweight of semiconductor components is increasingly urgent, So the flip-chip plastic package technologyhas been widely used. Because of the deformation of substrate and the mismatch of thermal expansion coefficient betweenpackaging materials, Bump Crack becomes one of the important factors affecting package reliability.In order to study the failure cause of Bump Crack in the package process, ANSYS is used to establish the finite element model of flip-chip plastic package, the deformation of plastic substrate and the stress distribution of bump point in reflow processare simulated, and the failure cause of bump crack is analyzed. The results show thatin the reflow process, the deformation quantity of substrate is larger than that of the bare core, and the bump point on the periphery is inclined greatly, which bears the largest stress and strain energy, so the bump point on the outer edge is the most vulnerable to failure, and the boat operation can significantly reduce the failure risk.

Key words: bump crack, finite element analysis, failure analysis