先进封装中凸点技术的研究进展

doi:10.16257/j.cnki.1681-1070.2023.0097

摘要/Abstract

摘要： 随着异构集成模块功能和特征尺寸的不断增加，三维集成技术应运而生。凸点之间的互连是实现芯片三维叠层的关键，制备出高可靠性的微凸点对微电子封装技术的进一步发展具有重要意义。整理归纳了先进封装中的凸点技术，包括凸点制备方法与材料、微观组织与力学性能、电性能与可靠性、仿真在凸点中的应用，为后续凸点研究提供参考。最后对凸点技术进行了展望，凸点工艺将继续向着微型化、小节距、无铅化和高可靠性方向发展。

关键词: 先进封装, 凸点, 高可靠性

Abstract: With the continuous increasing of function and feature size of heterogeneous integration modules, three-dimensional (3D) integration technology has emerged. The interconnection between bumps is the key to realize 3D stacking of chips, and the preparation of highly reliable micro bumps is of great significance for the further development of microelectronic packaging technology. This review summarized the bump technology in advanced packaging, including bump preparation methods and materials, microstructure and mechanical properties, electrical properties and reliability, and the application of simulation in bumps, providing reference for subsequent research on bumps. Finally, the projection technology will continue to develop towards miniaturization, small pitch, lead-free and high reliability.

Key words: advanced packaging, bump, high reliability

中图分类号:

TN305.94

沈丹丹. 先进封装中凸点技术的研究进展[J]. 电子与封装, 2023, 23(6): 060208 .

SHEN Dandan. Research Progress of Bump Technology in Advanced Packaging[J]. Electronics & Packaging, 2023, 23(6): 060208 .

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