激光烧结纳米铜膏成型线路的清洗工艺研究*

doi:10.16257/j.cnki.1681-1070.2023.0154

电子与封装 ›› 2023, Vol. 23 ›› Issue (9): 090206 . doi: 10.16257/j.cnki.1681-1070.2023.0154

激光烧结纳米铜膏成型线路的清洗工艺研究^*

张坤,徐广东,李权震,杨冠南,张昱,崔成强

广东工业大学省部共建精密电子制造技术与装备国家重点实验室，广州?510006

收稿日期:2023-06-12 出版日期:2023-09-25 发布日期:2023-09-25
作者简介:张坤（1997—），男，江西抚州人，硕士研究生，主要研究方向为微电子封装技术与材料。

Research on Cleaning Process of Forming Circuits of Laser Sintering Nano Copper Paste

ZHANG Kun, XU Guangdong, LI Quanzhen, YANG Guannan,ZHANG Yu, CUI Chengqiang

State Key Laboratory of Precision ElectronicManufacturing Technology and Equipment, GuangdongUniversity of Technology, Guangzhou 510006, China

Received:2023-06-12 Online:2023-09-25 Published:2023-09-25

摘要/Abstract

摘要： 提出一种基于紫外纳秒脉冲激光的纳米铜膏（铜的质量分数为85%）选择性烧结成型线路技术。采用乙醇超声清洗技术对成型线路进行清洗，剥离未烧结区的纳米铜膏。采用质量分数为30%的双氧水和质量分数为5%的硫酸，通过氧化酸洗技术去除热烧结区的纳米铜膏，从而获得纳米铜中心烧结区的成型线路。通过场发射扫描电子显微镜（SEM）和能谱色散型光谱仪（EDS）进行表征，证明清洗后的成型线路表面主要为金属铜，表层的纳米铜颗粒之间完全相融连接。该方法为激光烧结成型线路的清洗提供了参考。

关键词: 纳米金属颗粒, 激光烧结, 成型线路清洗

Abstract: A selective sintering formingcircuit technology for nano copper paste (with a mass fraction of 85% copper) based on ultraviolet nanosecond pulse laser is proposed.The formingcircuits are cleaned by ethanol ultrasonic cleaning technology, and the nanocopper paste in the unsintered areais stripped.Hydrogen peroxide with a mass fraction of 30% and sulfuric acid with a mass fraction of 5% are used to remove nanometer copper paste in hot sintering area by oxidation pickling technology, and the forming circuits in the center sintered area of nano copper are obtained. Characterization by field emission scanning electron microscopy (SEM) and energy dispersive spectroscopy (EDS) demonstrates that the cleaned surface of the formingcircuit is mainly composed of metallic copper, and the nano copper particles on the surface are completely fused and connected. This method provides a reference for the cleaning of laser sintering forming circuits.

Key words: metal nanoparticles, laser sintering, forming circuit cleaning

中图分类号:

TN305.94

张坤,徐广东,李权震,杨冠南,张昱,崔成强. 激光烧结纳米铜膏成型线路的清洗工艺研究^*[J]. 电子与封装, 2023, 23(9): 090206 .

ZHANG Kun, XU Guangdong, LI Quanzhen, YANG Guannan,ZHANG Yu, CUI Chengqiang. Research on Cleaning Process of Forming Circuits of Laser Sintering Nano Copper Paste[J]. Electronics & Packaging, 2023, 23(9): 090206 .

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中国半导体行业协会封装分会会刊

中国电子学会电子制造与封装技术分会会刊

激光烧结纳米铜膏成型线路的清洗工艺研究^*

Research on Cleaning Process of Forming Circuits of Laser Sintering Nano Copper Paste

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