中国半导体行业协会封装分会会刊

中国电子学会电子制造与封装技术分会会刊

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电子与封装 ›› 2024, Vol. 24 ›› Issue (9): 090202 . doi: 10.16257/j.cnki.1681-1070.2024.0108

• 封装、组装与测试 • 上一篇    下一篇

国产G200型LTCC生瓷带应用研究

兰耀海1,2;吕洋1,2;王飞1,2;沐方清1,2;张鹏飞1,2   

  1. 1. 中国电子科技集团公司第四十三研究所,合肥? 230088;2. 微系统安徽省重点实验室,合肥? 230088
  • 收稿日期:2024-04-01 出版日期:2024-09-25 发布日期:2024-09-25
  • 作者简介:兰耀海(1992—),男,山西大同人,硕士,工程师,现从事LTCC工艺、LTCC生瓷带流延和厚膜基板金属化工艺的研究工作。

Research on the Application of Domestic G200 Type LTCC Green Tape

LANYaohai1,2, LYUYang1,2, WANGFei1,2, MUFangqing1,2, ZHANG Pengfei1,2   

  1. 1.China Electronics Technology GroupCorporation No.43 Research Institute,Hefei 230088,China;
  • Received:2024-04-01 Online:2024-09-25 Published:2024-09-25

摘要: 为了推动低温共烧陶瓷(LTCC)生瓷带的国产化进程,同时系统深入地研究国产LTCC生瓷带的工艺加工性能和工程化应用,以进口LTCC浆料和自主研发的G200型LTCC生瓷带为研究对象,采用LTCC工艺制作测试基板,设计一系列应用验证实验方案,测试并研究G200型LTCC生瓷带的印刷精度、尺寸稳定性、烧结收缩率以及浆料共烧匹配性等关键性能。通过优化生瓷带的预热工艺、导体印刷等工艺参数,选择合适的基板放大系数及基板层数,使制作的LTCC基板产品达到实际应用要求。

关键词: 封装, LTCC, 工程化应用

Abstract: In order to promote the localization process of low-temperature co-fired ceramic (LTCC) green tapes, and systematically and deeply study the process performance and engineering application of domestic LTCC green tapes, taking imported LTCC paste and independently developed G200 type LTCC green tape as the research objects, LTCC process is used to make test substrate, and a series of application verification experiment schemes are designed to test and study the key properties of G200 type LTCC green tape, such as printing accuracy, dimensional stability, sintering shrinkage rate and paste co-firing compatibility. By optimizing the preheating process, conductor printing and other process parameters, selecting the appropriate substrate amplification factors and the number of substrate layers, the LTCC substrate products produced can meet the practical application requirements.

Key words: packaging, LTCC, engineering application

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