中国半导体行业协会封装分会会刊

中国电子学会电子制造与封装技术分会会刊

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电子与封装 ›› 2025, Vol. 25 ›› Issue (6): 060203 . doi: 10.16257/j.cnki.1681-1070.2025.0052

• 封装、组装与测试 • 上一篇    下一篇

某MEMS垂直探针在针测行程作用下的屈曲力学行为研究

秦林肖   

  1. 强一半导体苏州股份有限公司,江苏 苏州? 215000
  • 收稿日期:2024-10-07 出版日期:2025-06-27 发布日期:2025-01-20
  • 作者简介:秦林肖(1989—),男,江苏如皋人,硕士研究生,工程师,主要从事芯片测试结构件的热结构仿真分析及结构优化工作。

Study on the Buckling Mechanical Behavior of a MEMS Vertical Probe Under the Action of Needle Measurement Stroke

QIN Linxiao   

  1. Maxone Semiconductor Suzhou Co., Ltd., Suzhou ?215000, China
  • Received:2024-10-07 Online:2025-06-27 Published:2025-01-20

摘要: 探针卡作为一种测试接口,是连接芯片和测试机之间的中间媒介,而其中晶圆测试中所用的探针是测试机与晶圆上被测芯片之间进行通信的重要功能部件。基于某规格MEMS垂直探针,采用有限元分析软件,对比分析5根与所配合装配的探针卡上下盖板的初始接触状态不同的探针在同样的针测行程作用下各个探针的关键力学性能。基于屈曲理论,采用拟合方法推导探针平衡接触力与所加载针测行程间的函数关系式。

关键词: 探针卡, MEMS垂直探针, 有限元分析, 针测行程, 平衡接触力

Abstract: As a testing interface, the probe card serves as an intermediary between the chip and the testing machine, and the probes used in wafer testing are important functional components for communication between the testing machine and the tested chip on the wafer. Based on a certain specification of MEMS vertical probe, finite element analysis software was used to compare and analyze the key mechanical properties of five probes with different initial contact states with the upper and lower cover plates of the probe card assembled together under the same needle measurement stroke. Based on the buckling theory, a fitting method was used to derive the functional relationship between the balanced contact force of the probe and the loaded needle measurement stroke.

Key words: probe card, MEMS vertical probe, finite element analysis, needle measurement stroke, balanced contact force

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