金属种子层PVD溅射系统在面板级先进封装中的应用*

doi:10.16257/j.cnki.1681-1070.2025.0113

电子与封装 ›› 2025, Vol. 25 ›› Issue (10): 100201 . doi: 10.16257/j.cnki.1681-1070.2025.0113

• 封装、组装与测试 • 下一篇

金属种子层PVD溅射系统在面板级先进封装中的应用^*

张晓军，李婷，胡小波，杨洪生，陈志强，方安安

深圳市矩阵多元科技有限公司，广东深圳 518110

收稿日期:2025-02-20 出版日期:2025-10-29 发布日期:2025-03-27
作者简介:张晓军（1977—），男，江苏兴化人，博士，矩阵科技首席科学家，现从事面板级先进封装三维互连技术开发及物理气相沉积、化学气相沉积设备的研发工作。

Application of Metal Seed Layer PVD Sputtering System in Panel-Level Advanced Packaging

ZHANG Xiaojun, LI Ting, HU Xiaobo, YANG Hongsheng, CHEN Zhiqiang, FANG An’an

Arrayed Materials China Co., Ltd., Shenzhen 518110, China

Received:2025-02-20 Online:2025-10-29 Published:2025-03-27

摘要/Abstract

摘要： 物理气相沉积（PVD）溅射系统作为面板级先进封装的关键工艺设备之一，其性能直接影响到封装质量和可靠性。介绍了应用于大尺寸（510 mm×515 mm及以上）面板级先进封装的溅射系统，该系统配置了多个单元模块，在降低工艺成本的同时实现连续自动化溅射镀膜生产，自研的大尺寸阴极溅射系统可以有效提高沉积速率，同时提升靶材利用率至50%；自研冷却系统能显著降低基板表面温度，改善翘曲，实现更精细的控制；在510 mm×515 mm尺寸的基板上沉积的Ti、Cu薄膜的非均匀性分别为±3.05%和±2.36%，玻璃基板表面Ti/Cu薄膜附着力测试值高达277 N/cm²，降低了种子层沉积后脱落的风险，全流程均在真空系统内完成，减少了水汽及颗粒对基板的污染，研究结果为面板级先进封装技术的发展提供了重要的参考和指导。

关键词: 面板级先进封装, 物理气相沉积, 种子层, 大尺寸平面溅射阴极系统

Abstract: The physical vapor deposition (PVD) sputtering system is one of the key process equipment for panel-level advanced packaging, and its performance directly affects packaging quality and reliability. A sputtering system designed for large-size (510 mm×515 mm and above) panel-level advanced packaging is introduced. The system is equipped with multiple unit modules, enabling continuous automated sputter coating production while reducing process costs. The self-developed large-size cathode sputtering system effectively improves the deposition rate and increases target utilization to 50%. The self-developed cooling system significantly reduces substrate surface temperature, mitigates warpage, and achieves finer control. The non-uniformity of Ti and Cu film deposited on 510 mm×515 mm substrates is ±3.05% and ±2.36%, respectively. The adhesion strength of Ti/Cu films on glass substrates reaches 277 N/cm², reducing risks such as seed layer delamination. The entire process is completed within a vacuum system, minimizing contamination of substrates from moisture and particles. These findings provide crucial reference and guidance for panel-level advanced packaging technologies.

Key words: panel-level advanced packaging, physical vapor deposition, seed layer, large-size planar sputtering cathode system

中图分类号:

TN405

张晓军，李婷，胡小波，杨洪生，陈志强，方安安. 金属种子层PVD溅射系统在面板级先进封装中的应用^*[J]. 电子与封装, 2025, 25(10): 100201 .

ZHANG Xiaojun, LI Ting, HU Xiaobo, YANG Hongsheng, CHEN Zhiqiang, FANG An’an. Application of Metal Seed Layer PVD Sputtering System in Panel-Level Advanced Packaging[J]. Electronics & Packaging, 2025, 25(10): 100201 .

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中国半导体行业协会封装分会会刊

中国电子学会电子制造与封装技术分会会刊

金属种子层PVD溅射系统在面板级先进封装中的应用^*

Application of Metal Seed Layer PVD Sputtering System in Panel-Level Advanced Packaging

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