关键词: 复合微波印制板, 金丝楔焊, 劈刀

Abstract: The difficulties of automatic gold wire wedge bonding in high-density interconnection of composite microwave printed boards were discussed, including the difficulty of low hardness of printed boards, the poor consistency of the filling holes and the bonding surface height of printed boards. Multi-stage application of pressure and ultrasonic was implemented to reduce the impact of low substrate hardness, fine programming was designed to avoid the filling hole position of the wedge bonding point,and screening the median substrate height as the reference was applied to reduce the influence of the poor consistency of the bonding surface height,while the wedge-welding tool has been customized to achieve high-precision wedge bonding with a centerline space of not less than 45μm and was applied to mass production.

Key words: composite microwave printed boards, gold wire wedge bonding, wedge