中国半导体行业协会封装分会会刊

中国电子学会电子制造与封装技术分会会刊

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电子与封装 ›› 2020, Vol. 20 ›› Issue (12): 120304 . doi: 10.16257/j.cnki.1681-1070.2020.1213

• 电路设计 • 上一篇    下一篇

嵌入式温度模块设计

秦拴宝;殷华文   

  1. 南阳理工学院智能制造学院,河南 南阳 473004
  • 收稿日期:2020-08-12 发布日期:2020-09-01
  • 作者简介:秦拴宝(1996—),男,甘肃环县人,本科在读,主要研究过程控制、嵌入式控制;殷华文(1967—),男,河南南阳人,副教授,主要从事过程控制、嵌入式控制方向教学科研工作。

Designof Embedded Temperature Module

QIN Shuanbao, YIN Huawen   

  1. College of Intelligent Manufacturing, NanyangInstitute of Technology, Nanyang 473004,China
  • Received:2020-08-12 Published:2020-09-01

摘要: 基于Cortex-M3内核STM32F100C8T6单片机设计了一种嵌入式温度模块。模块有4路热电阻测温电路,能够实现对Pt100、Cu50等热电阻的温度检测;有2路热电偶测温电路,采用新型热电偶芯片MAX31855实现K型、J型等8种热电偶的温度检测;有4路模拟量输入电路和2路模拟量输出电路。温度模块使用SPI总线和智能控制器主CPU通信,SPI通讯利用芯片SI8441进行光电隔离。ADC电路使用嵌入式处理器的12位分辨率转换电路;DAC电路基于PWM波调制原理通过XTR111芯片输出分辨率为0.05%的4~20 mA电流。供电部分采用DC-DC隔离电源模块,组成全隔离信号系统和供电系统。经测试,温度模块对热电阻、热电偶信号的采集误差小于0.1 ℃。

关键词: 嵌入式温度模块, Cortex-M3, 热电阻测温, 热电偶测温

Abstract: An embedded temperature module of intelligent controller is designed based on Cortex-M3 core STM32F100C8T6 microcontroller. The module has 4 thermal resistance temperature measuring circuits, which can realize the temperature detection of Pt100, Cu50 and other thermal resistances. There are 2 thermocouple temperature measuring circuits, and the new thermocouple chip MAX31855 is used to realize the temperature detection of 8 kinds of thermocouples such as K type and J type. There are 4 analog input circuits and 2 analog output circuits.? The temperature module uses SPI to communicate with the main control CPU of the intelligent controller. SPI communication uses chip SI8441 for photoelectric isolation. ADC circuit uses 12-bit resolution conversion circuit of embedded processor; DAC circuit outputs 4-20 mA current with 0.05% resolution through XTR111 chip based on PWM wave modulation principle. The power supply part adopts a DC-DC isolated power supply module to form a fully isolated signal system and a power supply system. The test results show that the acquisition error of thermal resistance and thermocouple signal is less than 0.1 ℃.

Key words: embeddedtemperaturemodule, Cortex-M3, temperaturemeasurementbythermalresistance, thermocoupletemperaturemeasurement

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