关键词: 系统级封装, 多尺度, 等效模型, 热分析, 散热优化

Abstract: Aiming at the thermal simulation efficiency of multi-scale complex structures in system in package (SiP), the equivalent thermal conductivity method of thermal resistance network is adopted to derive the equivalent thermal conductivity model. Compared with the thermal simulation results of the accurate SiP model, the simulation efficiency of the equivalent model is 58% higher, and the simulation error is about 7.5%, which can ensure the simulation accuracy. Optimize the heat dissipation effects of the three schemes of natural convection with a radiator, forced air cooling with a radiator, and micro-channel liquid cooling. The results show that the micro-channel liquid cooling surface has a large teat transfer coefficient and heat dissipation capacity stronger, which fully satisfied the temperature requirements of high-power SiP reliable operation.

Key words: systeminpackage, multi-scale, equivalentmodel, thermalanalysis, heatdissipationoptimization