微混装焊料组织及力学性能研究进展

doi:10.16257/j.cnki.1681-1070.2021.0801

摘要/Abstract

摘要： 随着电子封装技术的快速发展，封装密度不断提高、焊点尺寸越来越小、焊接工艺窗口变窄，现今最常用的Sn-Ag-Cu焊料的性能越发难以满足先进封装技术的需求。以Sn-Ag-Cu焊料为基础进行微混装改性以提升其性能是现今电子封装用焊料研究的一个重要方向。从微合金化、增强相颗粒掺杂和多焊料超结构3种微混装方式综述微混装焊料的混装形式、改性机理和性能提升等方面的研究进展，同时对这几种混装方式的优劣势进行对比，介绍微混装研究的热点方向。

关键词: 先进封装, 微合金化, 增强相颗粒, 多焊料超结构

Abstract: With the rapid development of electronic packaging technology, the packaging density continues to rise, the size of solder joints is getting smaller, and the soldering process window is narrowing. The performance of the most commonly used Sn-Ag-Cu solder today is becoming more and more difficult to meet the needs of advanced packaging technology. Improving its performance by micro-mixing modification based on Sn-Ag-Cu solder is an important research direction of solders for electronic packaging. This article summarizes the research progress of micro-mixed solder's mixing form, modification mechanism and performance improvement from the three micro-mixed methods of microalloying, enhanced phase particle doping, and multi-solder superstructure. The advantages and disadvantages of mixed packaging methods are compared, and the hot research directions of micro-mixed packaging are introduced.

Key words: advanced packaging technology, microalloying, enhanced phase particle doping, multi-solder superstructure

中图分类号:

张尚;张墅野;何鹏. 微混装焊料组织及力学性能研究进展[J]. 电子与封装, 2021, 21(8): 080101 .

ZHANG Shang, ZHANG Shuye, HE Peng. Research Progress on Microstructures andMechanical Properties of Composite Solder[J]. Electronics & Packaging, 2021, 21(8): 080101 .

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中国半导体行业协会封装分会会刊

中国电子学会电子制造与封装技术分会会刊