面向超导量子器件的封装集成技术*

doi:10.16257/j.cnki.1681-1070.2023.0072

摘要/Abstract

摘要： 超导量子比特由于半导体工艺兼容性强，可扩展潜力大，易于操控、读出与耦合，是现阶段最有希望实现可扩展通用量子计算机的技术路线之一。然而，通用量子计算的实现需要百万量级的超导量子比特作为硬件基础，因此相应的封装架构需要在可扩展特性、超导材料体系、低损耗电互连、量子比特兼容性、电磁环境优化等方面进行新的探索。分析了传统引线键合在大规模集成过程中遇到的主要技术瓶颈；介绍了面向超导量子器件开发的一系列特殊互连架构，对其优势和局限性进行了探讨；详细讨论了集成电路领域先进封装技术在超导量子器件中的兼容性问题，主要涵盖倒装键合、硅通孔及系统集成方案3个方面，并对上述封装技术的发展趋势进行了展望。

关键词: 超导量子计算, 先进封装, 倒装键合, 硅通孔, 系统集成

Abstract: Superconducting quantum bit (qubit) is one of the most promising technology routes to realize scalable universal quantum computer at present because of its strong compatibility with semiconductor technology, large scalability potential, easy control, read-out and coupling. However, the realization of universal quantum computing requires millions of superconducting quantum bit as its hardware basis. Therefore, corresponding packaging architectures need to be explored in terms of scalable properties, superconducting material system, low-loss electrical interconnect, quantum bit compatibility, electromagnetic environment optimization. The main technical bottlenecks encountered by traditional wire bonding in the process of scaling up are analyzed. A series of special interconnection architectures developed for superconducting quantum devices are introduced, and the corresponding advantages and limitations are discussed. The compatibility of advanced packaging technologies in integrated circuits industry towards superconducting quantum devices is discussed in detail, mainly covering flip-chip bonding, through silicon via and and system integration solutions, providing an outlook on the trend of the above packaging technologies.

Key words: superconducting quantum computing, advanced packaging, flip chip bonding, through silicon via, system integration

中图分类号:

TN305.94

俞杰勋, 王谦, 郑瑶, 宋昌明, 方君鹏, 吴海华, 李铁夫, 蔡坚. 面向超导量子器件的封装集成技术^*[J]. 电子与封装, 2023, 23(3): 030108 .

YU Jiexun, WANG Qian, ZHENG Yao, SONG Changming, FANG Junpeng, WU Haihua, LI Tiefu, CAI Jian. Package IntegrationTechnology for Superconducting Quantum Devices[J]. Electronics & Packaging, 2023, 23(3): 030108 .

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中国半导体行业协会封装分会会刊

中国电子学会电子制造与封装技术分会会刊

面向超导量子器件的封装集成技术^*

Package IntegrationTechnology for Superconducting Quantum Devices

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