中国半导体行业协会封装分会会刊

中国电子学会电子制造与封装技术分会会刊

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电子与封装 ›› 2018, Vol. 18 ›› Issue (11): 36 -39. doi: 10.16257/j.cnki.1681-1070.2018.0125

• 微电子制造与可靠性 • 上一篇    下一篇

基于248 nm光刻机工艺的高性能0.15 μm GaAs LN pHEMT

章军云,王溯源,林 罡,黄念宁   

  1. 南京电子器件研究所,南京 210016
  • 收稿日期:2018-09-27 出版日期:2018-11-20 发布日期:2018-11-20
  • 作者简介:章军云(1983—),男,江西人,2009年毕业于南京电子器件研究所微电子专业,获硕士学位,现为南京电子器件研究所工程师,主要从事化合物半导体的工艺及器件开发工作。

High Performance 0.15 μm GaAs LN pHEMT Based on 248 nm Lithography

ZHANG Junyun,WANG Suyuan,LIN Gang,HUANG Nianning   

  1. Nanjing Electronic Devices Institute,Nanjing 210016,China
  • Received:2018-09-27 Online:2018-11-20 Published:2018-11-20

摘要: 报道了一种0.15 μm GaAs pHEMT的制作工艺,该工艺使用248 nm DUV光刻机和烘胶工艺方案。利用成熟的Ka波段宽带低噪声放大电路对该工艺进行了流片验证。微波测试结果显示,在26.5~40 GHz频段内,电路增益大于17.5 dB,在29.5 GHz处增益达19.9 dB;噪声系数小于2.4 dB,在33.1 GHz处,最小噪声1.96 dB;输入输出驻波比小于1.36,1 dB压缩点输出功率大于6.4 dBm,直流功耗为142.5 mW。和基于同样电路的电子束直写裸栅工艺相比,关键指标及生产效率都有明显提升。

关键词: 248 nm DUV光刻机, 烘胶工艺, GaAs pHEMT, Ka波段, 低噪声放大器

Abstract: In this paper,the fabrication process of a 0.15 μm GaAs pHEMT process was reported,which based on the 248 nm DUV lithography and resist thermal reflow technology.The process was verified by mature wide Ka-band low noise amplifier circuit.RF testing results show that,in 26.5~40 GHz band,the small-signal gain is greater than 17.5 dB,and up to 19.9 dB at 29.5 GHz;the noise figure is less than 2.4 dB,and reaches the minimum 1.96 dB at 33.1 GHz.Both the input and output voltage standing wave ratios(VSWR)are less than 1.36,the output power of 1 dB compression point is more than 6.4 dBm,moreover,the DC power consumption is only about 142.5 mW.Compared with the same circuit based on electron beam direct writing bare gate technology,the key indicatorsand manufacturing efficiency hasimproved significantly.

Key words: 248 nm DUVlithography, resistthermalreflow process, GaAspHEMT, Kaband, low noiseamplifier

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