关键词: 共晶芯片焊接平台, IC芯片, 低噪声放大器

Abstract: Eutectic die bonding platform is widely used in surface mount discrete semiconductor assembly due to its high efficiency, low thermal resistance and low cost. With the extensive use of mobile consumer electronics, more and more IC chips are placed into small surface packages. For the IC chip without backmetal on the bottom, the low noise amplifier IC chip is assembled into the SC88 package after different processes are compared and selected, and it has passed the reliability test and successfully achieved mass production.

Key words: eutectic die bonding platform, IC chip, low noise amplifier