关键词: GaAs通孔刻蚀, 微掩模, 聚合物

Abstract: The viaetching play avery important role in GaAsmanufacture.Thebackside metal connect frontal metal through GaAs via.In via etching process,the formation of micro mask impact device parameter and reliability harmfully,which block the GaAs etching and form abundant pillars in GaAs vias Polymer is accumulated on the surface of GaAs via simultaneously,which can cause backside metal connect badly and cling weakly.It will impact somekey parameterssuch asvia resistance and inductance,and will affect device performanceand reliability ultimately.Thispaper analyzesthemain causeand machaism of GaAsmicro mask formation systematically.Thepillar and polymer formation areeliminated through processoptimization,which will improvedeviceperformanceand reliability ultimately.

Key words: GaAsviaetching, micro mask, polymer