乙基纤维素影响下的微米银焊膏和纳米银焊膏烧结对比研究*

doi:10.16257/j.cnki.1681-1070.2025.0037

电子与封装 ›› 2025, Vol. 25 ›› Issue (3): 030102 . doi: 10.16257/j.cnki.1681-1070.2025.0037

所属专题：第三代半导体功率电子封装技术

• “第三代半导体功率电子封装技术”专题 • 上一篇下一篇

乙基纤维素影响下的微米银焊膏和纳米银焊膏烧结对比研究^*

喻龙波¹,夏志东¹,邓文皓¹,林文良²,周炜¹,郭福^1,3

1. 北京工业大学材料科学与工程学院，北京? 100124；2. 重庆群崴电子材料有限公司，重庆? 408102；3. 北京信息科技大学机电工程学院，北京? 102206

收稿日期:2024-10-12 出版日期:2025-03-28 发布日期:2025-03-28
作者简介:喻龙波（2000—），男，山东济南人，硕士研究生，主要研究方向为电子封装。

Comparative Study on the Sintering of Ag Microparticles Solder Paste and Ag Nanoparticles Solder Paste Under the Influence of Ethyl Cellulose

YU Longbo¹, XIA Zhidong¹, DENG Wenhao¹, LIN Wenliang², ZHOU Wei¹, GUO Fu^1,3

1. College ofMaterials Science and Engineering, BeijingUniversity of Technology, Beijing 100124, China; 2.Chongqing Qunwin Electronic Materials Co., Ltd., Chongqing 408102, China; 3. College of Mechanical and ElectricalEngineering, Beijing InformationScience & Technology University,Beijing 102206, China

Received:2024-10-12 Online:2025-03-28 Published:2025-03-28

摘要/Abstract

摘要： 微米银（Ag MPs）焊膏和纳米银（Ag NPs）焊膏因其低温烧结、高温服役的特点而成为最有可能用于高温封装的连接材料。研究了乙基纤维素对Ag MPs和Ag NPs焊膏烧结结果的影响，分析了相同条件下2组焊膏烧结结果存在差异的原因。结果表明，在无压、250 ℃、空气条件下，添加质量分数为5%的乙基纤维素，2组焊膏的烧结性能较好，Ag MPs焊膏烧结所得接头强度和薄膜电阻率为8.57 MPa和4.25 μΩ·cm，Ag NPs焊膏烧结所得接头强度和薄膜电阻率为32.89 MPa和7.71 μΩ·cm。接头界面和薄膜微观形貌表明，烧结后颗粒间形成的烧结颈和烧结组织均匀性是影响连接强度的关键因素，而烧结组织致密度则是影响导电性的主要因素。研究结果为进一步提高银焊膏烧结接头强度和烧结薄膜导电性提供了参考。

关键词: 乙基纤维素, 微米银焊膏, 纳米银焊膏, 烧结性能

Abstract: The Ag microparticles (Ag MPs) solder paste and the Ag nanoparticles (Ag NPs) solder paste are the most likely connection materials for high-temperature packaging due to their characteristics of low-temperature sintering and high-temperature service. The influence of ethyl cellulose on the sintering results of Ag MPs solder paste and Ag NPs solder paste is studied, and the reasons for the differences in sintering results between the 2 groups of solder pastes under the same conditions are analyzed. The results show that the sintering properties of the 2 groups of solder pastes are better with the addition of ethyl cellulose with a mass fraction of 5% under the conditions of no pressure, 250 ℃, and air, the joint strength and film resistivity obtained by sintering of Ag MPs solder paste are 8.57 MPa and 4.25 μΩ·cm, and the joint strength and film resistivity obtained by sintering of Ag NPs solder paste are 32.89 MPa and 7.71 μΩ·cm. The microstructures of the joint interface and film show that the sintering neck formed between particles after sintering and the uniformity of sintered microstructure are key factors affecting the bonding strength, while the density of sintered microstructure is the main factor affecting the electrical conductivity. The research results provide a reference for further improving the strength of silver solder paste sintered joints and the electrical conductivity of the sintered film.

Key words: ethyl cellulose, Ag microparticles solder paste, Ag nanoparticles solder paste, sintering property

中图分类号:

喻龙波,夏志东,邓文皓,林文良,周炜,郭福. 乙基纤维素影响下的微米银焊膏和纳米银焊膏烧结对比研究^*[J]. 电子与封装, 2025, 25(3): 030102 .

YU Longbo, XIA Zhidong, DENG Wenhao, LIN Wenliang, ZHOU Wei, GUO Fu. Comparative Study on the Sintering of Ag Microparticles Solder Paste and Ag Nanoparticles Solder Paste Under the Influence of Ethyl Cellulose[J]. Electronics & Packaging, 2025, 25(3): 030102 .

参考文献

[1] YANG H. Study on the preparation process and sintering performance of doped nano-silver paste[J]. Reviews on Advanced Materials Science, 2022, 61(1): 969-976.
[2] ZHANG L, YUAN X B, WU X J, et al. Performance evaluation of high-power SiC MOSFET modules in comparison to Si IGBT modules[J]. IEEE Transactions on Power Electronics, 2019, 34(2): 1181-1196.
[3] 张宸赫, 李盼桢, 董浩楠, 等. 高功率半导体用纳米银焊膏的研究现状[J]. 电子与封装, 2024, 24(5): 050203.
[4] LIU Y C, TEO J W R, TUNG S K. High-temperature creep and hardness of eutectic 80Au/20Sn solder[J].
Journal of Alloys and Compounds, 2008, 448(1/2): 340-343.
[5] KIM S, KIM K S, KIM S S, et al. Interfacial reaction and die attach properties of Zn-Sn high-temperature solders[J]. Journal of Electronic Materials, 2009, 38(2): 266-272.
[6] CHEN C T, KIM D J, WANG Z H, et al. Low temperature low pressure solid-state porous Ag bonding for large area and its high-reliability design in die-attached power modules[J]. Ceramics International, 2019, 45(7): 9573-9579.
[7] LI M Y, XIAO Y, ZHANG Z H, et al. Bimodal sintered silver nanoparticle paste with ultrahigh thermal conductivity and shear strength for high temperature thermal interface material applications[J]. ACS Applied Materials & Interfaces, 2015, 7(17): 9157-9168.
[8] QU G D, DENG Z Y, GUO W, et al. The heat-dissipation sintered interface of power chip and heat sink and its high-temperature thermal analysis[J]. IEEE Transactions on Components, Packaging and Manufacturing Technology, 2023, 13(6): 816-822.
[9] FANG Y C, WANG Y C, OUYANG F Y. Low-temperature bonding process by silver nanoparticles paste for power electronic devices[J]. Journal of Electronic Materials, 2023, 52(2): 792-800.
[10] YANG J, DONG H N, HUANG Z, et al. Exploration of organic matrixes in conductive silver paste: A comprehensive review[J]. Journal of Materials Science: Materials in Electronics, 2024, 35(18): 1248.
[11] GAO Q, ZHOU W, XIA Z D, et al. Investigation of ethylene glycol, α-terpineol, and polyethylene glycol 400 on the sintering properties of Cu-Ag core-shell micro/nano-mixed paste[J]. Journal of Materials Science: Materials in Electronics, 2023, 34(21): 1585.
[12] FENG J J, GAO Y J, ZHANG F Q, et al. Effects of organic binder on rheological behaviors and screen-printing performance of silver pastes for LTCC applications[J]. Journal of Materials Science: Materials in Electronics, 2022, 33(14): 10774-10784.
[13] HSIANG H I, CHEN C C, FAN L F, et al. Rheological behaviors of silver conductive pastes with ethyl cellulose[J]. Circuit World, 2020, 47(1): 43-49.
[14] HU P A, O’NEIL W, HU Q. Synthesis of 10 nm Ag nanoparticle polymer composite pastes for low temperature production of high conductivity films[J]. Applied Surface Science, 2010, 257(3): 680-685.
[15] SCHWARZBAUER H, KUHNERT R. Novel large area joining technique for improved power device performance[J]. IEEE Transactions on Industry Applications, 1991, 27(1): 93-95.
[16] YU F, JOHNSON R W, HAMILTON M C. Process optimization of pressure-assisted rapid Ag sintering die attach for 300 ℃ applications[J]. IEEE Transactions on Components, Packaging and Manufacturing Technology, 2017, 7(6): 855-861.
[17] WANG T, CHEN X, LU G Q, et al. Low-temperature sintering with nano-silver paste in die-attached interconnection[J]. Journal of Electronic Materials, 2007, 36(10): 1333-1340.
[18] 李志豪，汪松英，洪少健，等. 镀银板表面粗糙度对纳米银焊膏快速烧结互连质量的影响[J]. 电子与封装，2024, 24（7）：070201.
[19] BAI J G, LU G Q. Thermomechanical reliability of low-temperature sintered silver die attached SiC power device assembly[J]. IEEE Transactions on Device and Materials Reliability, 2006, 6(3): 436-441.
[20] CHUA S T, SIOW K S. Microstructural studies and bonding strength of pressureless sintered nano-silver joints on silver, direct bond copper (DBC) and copper substrates aged at 300 ℃[J]. Journal of Alloys and Compounds, 2016, 687: 486-498.
[21] VOLLATH D. Criteria ruling particle agglomeration[J]. Beilstein Journal of Nanotechnology, 2021, 12: 1093-1100.
[22] 费维栋. 固体物理[M]. 哈尔滨: 哈尔滨工业大学出版社, 2020.
[23] 张帆, 郭益平, 周伟敏. 材料性能学[M]. 上海: 上海交通大学出版社, 2021
[24] JIU J T, ZHANG H, NAGAO S, et al. Die-attaching silver paste based on a novel solvent for high-power semiconductor devices[J]. Journal of Materials Science, 2016, 51(7): 3422-3430.
[25] ZHANG H Q, BAI H L, JIA Q, et al. High electrical and thermal conductivity of nano-Ag paste for power electronic applications[J]. Acta Metallurgica Sinica (English Letters), 2020, 33(11): 1543-1555.
[26] ZURUZI A S, SIOW K S. Electrical conductivity of porous silver made from sintered nanoparticles[J]. Electronic Materials Letters, 2015, 11(2): 308-314.
[27] ZHUO L C, WANG Q H, SUN J C, et al. Size-dependent thermal properties and sintering behaviors of silver nanoparticles: insights from molecular dynamics simulation[J]. Applied Physics A, 2024, 130(6): 394
[28] LI Y, JING H Y, HAN Y D, et al. Microstructure and joint properties of nano-silver paste by ultrasonic-assisted pressureless sintering[J]. Journal of Electronic Materials, 2016, 45(6): 3003-3012.
[29] YANG F, HU B, PENG Y, et al. Ag microflake-reinforced nano-Ag paste with high mechanical reliability for high-temperature applications[J]. Journal of Materials Science: Materials in Electronics, 2019, 30(6): 5526-5535.
[30] 中央军委装备发展部. 半导体分立器件试验方法: GJB 128B—2021[S]. 北京: 国家军用标准出版发行部, 2022.
[31] LI X, CHEN G, CHEN X, et al. Mechanical property evaluation of nano-silver paste sintered joint using lap-shear test[J]. Soldering and Surface Mount Technology, 2012, 24(2): 120-126.
[32] YANG C A, YANG S, LIU X, et al. Enhancement of nano-silver chip attachment by using transient liquid phase reaction with indium[J]. Journal of Alloys and Compounds, 2018, 762: 586-597.
[33] GADAUD P, CACCURI V, BERTHEAU D, et al. Ageing sintered silver: Relationship between tensile behavior, mechanical properties and the nanoporous structure evolution[J]. Materials Science and Engineering: A, 2016, 669: 379-386.

中国半导体行业协会封装分会会刊

中国电子学会电子制造与封装技术分会会刊

乙基纤维素影响下的微米银焊膏和纳米银焊膏烧结对比研究^*

Comparative Study on the Sintering of Ag Microparticles Solder Paste and Ag Nanoparticles Solder Paste Under the Influence of Ethyl Cellulose

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