三维集成无源电路研究进展*

doi:10.16257/j.cnki.1681-1070.2026.0014

摘要/Abstract

摘要： 在射频系统不断发展的背景下，射频电路在移动通信、卫星发射以及工业自动化等领域得到了广泛的应用。然而，随着技术的进步，对设备性能的要求越来越高，导致传统的电路设计在满足系统对小型化、低损耗和高集成度的需求上显得捉襟见肘。因此，垂直互连技术作为三维集成电路的核心，已被研究人员广泛应用于集成各类射频电路模块。这一技术不仅有效缩小了移动通信等领域射频电路的占用面积，还为其后续发展开辟了新的可能性。主要介绍了基于三维集成的无源电路的研究进展，包括三维集成滤波器、耦合器、变压器和巴伦，并对各无源电路的发展现状和发展前景做了总结和展望。

关键词: 三维集成, 射频系统, 无源电路, 垂直互连

Abstract: In the context of the continuous development of radio frequency (RF) systems, RF circuits have been widely used in the fields of mobile communication, satellite launch and industrial automation. However, with the progress of technology, the requirements for device performance are getting higher and higher, and the traditional circuit design cannot meet the requirements of miniaturization, low loss and high integration. Therefore, as the core of three-dimensional (3D) integrated circuits, vertical interconnection technology has been widely used by researchers to integrate various RF circuit modules. This technology not only effectively reduces the occupied area of RF circuits in mobile communications and other fields, but also opens up new possibilities for its subsequent development. The research progress of passive circuits based on 3D integration is introduced, including 3D integrated filters, couplers, transformers and baluns. The development status of each passive circuit is summarized, and their prospects are discussed.

Key words: three-dimensional integration, radio frequency system, passive circuit, vertical interconnection

中图分类号:

TN454

邓悦，王凤娟，尹湘坤，杨媛，余宁梅. 三维集成无源电路研究进展^*[J]. 电子与封装, 2026, 26(2): 00 -020201.

DENG Yue, WANG Fengjuan, YIN Xiangkun, YANG Yuan, YU Ningmei. Research Progress on Three-Dimensional Integrated Passive Circuits[J]. Electronics & Packaging, 2026, 26(2): 00 -020201.

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中国电子学会电子制造与封装技术分会会刊

中国半导体行业协会封测分会会刊

无锡市集成电路学会会刊

三维集成无源电路研究进展^*

Research Progress on Three-Dimensional Integrated Passive Circuits

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