关键词: 平行缝焊, AD590, 热效应量化, 参数优化, 质量评价, 微电子封装

Abstract: Addressing challenges such as the difficulty of real-time monitoring of shell temperature during parallel seam welding and the lack of quantitative basis for the thermal effects of process parameters, this study proposes a shell temperature measurement method based on the AD590 temperature sensor chip. Through the design of a single-point temperature compensation circuit (accuracy ±2 °C), the system investigates the mechanisms by which seam welding power, pulse width, repetition time, and seam welding speed on the temperature rise of the shell during parallel seam welding. For the first time, an equivalent thermal effect model for key parameters was established, revealing a linear relationship between duty cycle and temperature rise, as well as a constant temperature phenomenon at the same duty cycle. Additionally, a quality evaluation system for seam welding was proposed, encompassing eight indicators including weld appearance, seam welding strength, and thermal shock effects on insulators.

Key words: parallel seam welding, AD590, thermal effect quantification, parameter optimization, quality evaluation, microelectronic packaging