关键词: 两相浸没式冷却, 沸腾增强结构, 热管理, 临界热通量, 均热板

Abstract: With the rapid advancement in artificial intelligence and integrated circuit technology, the thermal power of high-performance computing chips in data centers has significantly increased. Two-phase immersion cooling has emerged as a highly promising next-generation cooling solution for data centers due to its efficient heat dissipation and eco-friendly energy-saving characteristics. This technology leverages the phase transition of the cooling fluid on the chip surface to efficiently dissipate heat in the form of latent heat. Key factors influencing phase transition efficiency include improving chip surface wettability and bubble dynamics. This paper summarizes the influencing factors and enhancement mechanisms of micro- and nanoscale structures on two-phase immersion cooling performance. It reviews and compares recent research findings on micro-nano composite structures, analyzes the current limitations of two-phase immersion cooling technology, and proposes an integrated heat spreader immersion cooling solution to provide reference for future technological development.

Key words: two-phase immersion cooling, boiling enhancement structures, thermal management, critical heat flux, vapor chamber