关键词: 玻璃基板, 翘曲, 残余应力, 阴影云纹

Abstract: As a critical material for next-generation advanced packaging, glass substrates demonstrate enormous potential in 2.5D high-computing-power chip packaging. Focusing on the chip-on-wafer-on-substrate (CoWoS) advanced packaging technology, this study conducted a comparative analysis of the thermomechanical properties between organic substrates and glass substrates applied. A finite element model was established and combined with measured data from Shadow Moiré to verify the accuracy of the simulation. A comparison of simulation results for different core substrates revealed that the package with the organic substrate exhibited a warpage of 349.3 µm and a maximum core stress of 144.81 MPa at 28 °C. In contrast, the package with the glass substrate showed a warpage of 212.1 µm and a significantly lower maximum core stress of 22.13 MPa at the same temperature. The glass substrate-based package demonstrated superior dimensional stability and mechanical reliability, providing an important basis for high-density packaging design.

Key words: glass substrate, warpage, residual stress, shadow moiré