关键词: 三维集成芯片, 混合键合, 界面可靠性, 有限元数据库, 协同优化, 优化设计平台

Abstract: The thermo-mechanical reliability of hybrid bonding interfaces in three-dimensional integrated circuits is governed by the coupled effects of structural parameters, process temperature, and interfacial conditions. Conventional finite-element analysis under single operating conditions is insufficient to support rapid exploration of the process–design space. To address the reliability evaluation challenge of hybrid bonding interfaces, this work proposes a data-driven assessment framework based on a finite-element simulation database and develops an interactive optimization design platform. A local two-dimensional plane-strain finite-element model is first established, and an equivalent thermo-mechanical loading strategy is introduced to capture the stress evolution across key process stages. On this basis, a full-factorial finite-element database is constructed using Cu pad pitch, pad width, Cu dishing equivalent parameter, and annealing temperature as design variables, from which key interfacial stress response metrics are extracted. Furthermore, a multi-metric reliability evaluation framework is developed by integrating the entropy-weight method with a critical-stage envelope risk indicator. Pareto non-dominated sorting and an auxiliary ranking metric are then employed to enable efficient screening and prioritization of candidate design solutions. Results demonstrate that the proposed method enables efficient evaluation of interfacial reliability risks and rapid exploration of the design space, providing an effective tool for the co-optimization of structure and process in hybrid bonding for three-dimensional integrated circuits.

Key words: 3D integrated chips, hybrid bonding, interface reliability, finite element database, co-optimization, design optimization platform