关键词: BGA器件, 质量控制, 防护

Abstract: The recent development of high-density electronic packaging technology has distinguished BGA as the best choice for high-density,high-performance,multi-functional and high I/Os devices.In the paper,the causes of failure during the screening process and countermeasures including materials,process control and quality control are analyzed.Meanwhile, the field control,solder ball protection and management during the screening process are highlighted.

Key words: BGA device, quality control, protection