中国半导体行业协会封装分会会刊

中国电子学会电子制造与封装技术分会会刊

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电子与封装 ›› 2023, Vol. 23 ›› Issue (3): 030104 . doi: 10.16257/j.cnki.1681-1070.2023.0063

所属专题: 先进三维封装与异质集成

• “先进三维封装与异质集成”专题 • 上一篇    下一篇

临时键合技术在晶圆级封装领域的研究进展*

王方成1,2,刘强1,2,李金辉1,2,叶振文3,黄明起3,张国平1,2,孙蓉1,2   

  1. 1. 中国科学院深圳先进技术研究院,深圳  518055;2. 深圳先进电子材料国际创新研究院,深圳  518103;3. 深圳市化讯半导体材料有限公司,深圳 518103
  • 收稿日期:2022-10-24 出版日期:2023-03-24 发布日期:2023-03-24
  • 作者简介:王方成(1990—),男,河南商丘人,博士,助理研究员,主要研究方向为面向晶圆级封装中临时键合技术的机理及工艺。

Research Progress of Temporary Bonding Technology in Wafer Level Packaging

WANG Fangcheng1,2, LIU Qiang1,2, LI Jinhui1,2, YE Zhenwen3, HUANG Mingqi3, ZHANG Guoping1,2, SUN Rong1,2   

  1. 1. Shenzhen Institute of Advanced Technology, Chinese Academy of Sciences, Shenzhen 518055, China; 2. Shenzhen Institute of Advanced Electronic Materials, Shenzhen 518103, China; 3. Shenzhen Samcien Semiconductor Materials Co., Ltd., Shenzhen 518103, China
  • Received:2022-10-24 Online:2023-03-24 Published:2023-03-24

摘要: 随着5G、人工智能和物联网等新基建的逐步完善,单纯依靠缩小工艺尺寸来提升芯片功能和性能的方法已经难以适应未来集成电路产业发展的需求。为满足集成电路的多功能化及产品的多元化,通过晶圆级封装技术克服摩尔定律物理扩展的局限性日趋重要。目前,在晶圆级封装正朝着大尺寸、三维堆叠和轻薄化方向发展的背景下,临时键合与解键合(TBDB)工艺应运而生。针对晶圆级封装领域可商用的TBDB技术,论述了不同TBDB工艺在晶圆级封装领域的研究进展及应用现状,明晰了不同TBDB技术所面临的挑战和机遇,提出了相应的解决方案,并展望了未来的研究方向。

关键词: 临时键合, 解键合, 晶圆级封装

Abstract: With the gradual improvement of new infrastructures such as 5G, artificial intelligence and the internet of things, it is no longer possible to rely solely on process size reduction to improve the functionality and performance of chips to meet the future needs of the integrated circuit (IC) industry. In order to meet the performance versatility and product diversification of IC, it is increasingly important to overcome the limitations of the physical scaling of Moore's Law through wafer level packaging technology. Temporary bonding/debonding (TBDB) processes have emerged as wafer-level packaging is moving towards to the direction of larger sizes, three-dimensional stacks and thinning. Aiming at the commercially available TBDB technology in wafer level packaging, the current research progress and application status of different TBDB processes in wafer level are discussed, the challenges and opportunities faced by different TBDB technologies are clarified, corresponding solutions are proposed, and future research direction is envisaged.

Key words: temporary bonding, debonding, wafer level packaging

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