中国半导体行业协会封装分会会刊

中国电子学会电子制造与封装技术分会会刊

导航

电子与封装 ›› 2023, Vol. 23 ›› Issue (11): 110302 . doi: 10.16257/j.cnki.1681-1070.2023.0149

• 电路与系统 • 上一篇    下一篇

适用于EEPROM的宽工作条件LDO设计

周旺,李一男,陈风凉,沈鑫,王留所   

  1. 中国电子科技集团公司第五十八研究所,江苏 无锡 214035
  • 收稿日期:2023-06-12 出版日期:2023-11-28 发布日期:2023-11-28
  • 作者简介:周旺(1995—),男,江苏宿迁人,本科,助理工程师,主要从事反熔丝FPGA及SRAM等存储器研发工作;

Design of an LDO for EEPROM with Wide Working Condition

ZHOU Wang,LI Yi'nan,CHEN Fengliang,SHEN Xin,WANG Liusuo   

  1. China ElectronicsTechnology Group Corporation No.58 ResearchInstitute, Wuxi 214035, China
  • Received:2023-06-12 Online:2023-11-28 Published:2023-11-28

摘要: 设计了一种适用于EEPROM的LDO电路。该电路在电源电压为2.3~5.7 V、工作温度为-60~135℃时可获得稳定的1.8V输出电压,为EEPROM单元读取操作提供所需栅电压。采用国内0.18 μm商用工艺,版图尺寸为480 μm×100 μm。给出了Hspice仿真环境下的仿真结果。

关键词: EEPROM, LDO, 宽电源电压, 高启动速度, 低功耗

Abstract: An LDO circuit for EEPROM is designed. This circuit can obtain a stable output voltage of 1.8 V when the power supply voltage is 2.3-5.7 V and the operating temperature is -60-135℃, providing the required gate voltage for EEPROM cell reading operation. This design adopts domestic 0.18 μm commercial process, its layout size is 480 μm×100 μm. Simulation results under the Hspice simulation environment are provided.

Key words: EEPROM, LDO, wide power supply voltage, high startup speed, low power consumption

中图分类号: