关键词: 封装技术, TSV转接板, 无损检测

Abstract: Using silicon through via (TSV) as the core technology to package 3D integrated circuits with silicon interposers can effectively shorten the interconnection length of devices. TSV interposers are widely used in microelectronics, but relatively little research has been done on inspection technology during their process preparation. The inspection of TSV interposers is critical for evaluating their yield rate and application reliability. Therefore, seven non-destructive inspection technologies are summarized, the basic principles, advantages and disadvantages of the non-destructive inspection technologies are discussed, and a systematic evaluation method for non-destructive inspection of 2.5D TSV interposers is formed. The method not only provides support for the research and development of 2.5D micro-module products, but also meets the typical application requirements of 3D package.

Key words: packaging technology, TSV interposer, non-destructive inspection