功率模块封装用环氧树脂改性技术应用进展*

doi:10.16257/j.cnki.1681-1070.2025.0056

电子与封装 ›› 2025, Vol. 25 ›› Issue (3): 030105 . doi: 10.16257/j.cnki.1681-1070.2025.0056

所属专题：第三代半导体功率电子封装技术

• “第三代半导体功率电子封装技术”专题 • 上一篇下一篇

功率模块封装用环氧树脂改性技术应用进展^*

曹凤雷¹,贾强^1,2,王乙舒¹,刘若晨¹,郭褔^1,3

1. 北京工业大学材料科学与工程学院，北京?100124；2. 北京工业大学重庆研究院，重庆 ?400015；3. 北京信息科技大学机电工程学院，北京 ?100096

收稿日期:2024-12-03 出版日期:2025-03-28 发布日期:2025-01-20
作者简介:曹凤雷（1996—），男，安徽亳州人，博士研究生，研究方向为先进电子封装材料。

Progress in the Application of Epoxy Resin Modification Technology for Power Module Package

CAO Fenglei¹, JIA Qiang^{1, 2}, WANG Yishu¹, LIU Ruochen¹, GUO Fu^{1, 3}

1. School of Materials Science and Engineering, Beijing University of Technology, Beijing100124, China; 2. Chongqing Research Institute, Beijing Universityof Technology, Chongqing 400015, China;3. School of Mechanical and Electrical Engineering, Beijing Information Science andTechnology University, Beijing 100096, China

Received:2024-12-03 Online:2025-03-28 Published:2025-01-20

摘要/Abstract

摘要： 环氧树脂因其优异的电气绝缘性、机械强度和耐高温性能，是功率模块封装材料的首选。然而，功率模块的集成度提升和服役环境的严苛化对环氧树脂的性能要求不断提高。对环氧树脂的分类、改性及其在功率模块封装中的应用进行总结，并指出了环氧树脂面临的挑战和未来发展方向。改性后的环氧树脂可以提升功率模块封装的热管理能力、绝缘性能、耐腐蚀性和抗翘曲能力等。未来的研究方向包括耐高温封装材料的开发、环保和多功能环氧树脂的探索，以及新材料和新工艺的结合。

关键词: 环氧树脂, 功率模块封装, 改性技术, 热管理能力, 绝缘性能

Abstract: Epoxy resins are the first choice for power module package materials due to their excellent electrical insulation, mechanical strength and high temperature resistance. As the integration degree of power modules increases and the service environment becomes increasingly demanding, the performance requirements for epoxy resins continue to improve. The classification, modification and application of epoxy resins in the power module package are summarized, and the challenges faced by epoxy resins and their future development directions are pointed out. The modified epoxy resins can improve the thermal management capability, insulation performance, corrosion resistance and warping resistance of the power module package. Future research directions include the development of high temperature resistant packaging materials, the exploration of environmentally friendly and multi-functional epoxy resins, and the combination of new materials and new processes.

Key words: epoxy resin, power module package, modification technology, thermal management capability, insulation performance

中图分类号:

TN305.94

曹凤雷,贾强,王乙舒,刘若晨,郭褔. 功率模块封装用环氧树脂改性技术应用进展^*[J]. 电子与封装, 2025, 25(3): 030105 .

CAO Fenglei, JIA Qiang, WANG Yishu, LIU Ruochen, GUO Fu. Progress in the Application of Epoxy Resin Modification Technology for Power Module Package[J]. Electronics & Packaging, 2025, 25(3): 030105 .

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中国半导体行业协会封装分会会刊

中国电子学会电子制造与封装技术分会会刊

功率模块封装用环氧树脂改性技术应用进展^*

Progress in the Application of Epoxy Resin Modification Technology for Power Module Package

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