功率器件封装纳米浆料材料与低温烧结工艺及机理研究进展*

doi:10.16257/j.cnki.1681-1070.2025.0058

摘要/Abstract

摘要： 随着电力电子器件材料的发展，第三代宽禁带半导体（如SiC和GaN）因其优越的性能而成为功率器件的理想材料。然而，面对大功率和高温应用的挑战，传统的锡基封装材料已经难以满足需求，为此，研究者们开始关注可以低温烧结、高温服役的纳米烧结浆料。这些微米、纳米级的铜、银等浆料可以在远低于金属熔点的温度下烧结成具备高熔点、高导热、高性能的焊点结构。从烧结材料、烧结工艺、烧结机理3个方面讨论了近年来用于功率器件封装的烧结浆料的研究进展，具体包括纳米银、纳米铜、铜银复合和其他纳米级烧结材料，以及它们适配的热压烧结、无压烧结、薄膜烧结等工艺，为烧结浆料的进一步发展提供参考。

关键词: 纳米浆料, 烧结, 功率器件, 电子封装技术, 烧结纳米铜

Abstract: With the development of materials for power electronic devices, third-generation wide-bandgap semiconductors (such as SiC and GaN) have emerged as ideal materials for power devices due to their remarkable performance. However, facing the challenges of high-power and high-temperature applications, traditional tin-based packaging materials have difficulties in meeting the requirements of high-power and high-temperature applications. As a result, researchers have begun to focus on nanosintered pastes that can be sintered at low temperatures and serve at high temperatures. These micro- and nano-scale copper and silver pastes can be sintered at temperatures well below the melting point of the metal to form solder joint structures with a high melting point, high thermal conductivity, and high performance. The research progress of sintered pastes for power device packaging in recent years is discussed from three aspects: sintering materials, sintering process, and sintering mechanism, specifically including nano Ag, nano Cu, Ag-Cu composites, and other nano-sized sintering materials, as well as their corresponding processes such as thermal pressure sintering, pressureless sintering, and thin-film sintering techniques, in order to provide references for the further development of sintering pastes.

Key words: nano paste, sinter, power device, electronics packaging technology, sinter nano Cu

中图分类号:

TN305.94

王一平,于铭涵,王润泽,佟子睿,冯佳运,田艳红. 功率器件封装纳米浆料材料与低温烧结工艺及机理研究进展^*[J]. 电子与封装, 2025, 25(3): 030106 .

WANG Yiping, YU Minghan, WANG Runze, TONG Zirui, FENG Jiayun, TIAN Yanhong. Advances in Nanopaste Materials and Low Temperature Sintering Process and Mechanism for Power Device Packaging[J]. Electronics & Packaging, 2025, 25(3): 030106 .

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中国半导体行业协会封装分会会刊

中国电子学会电子制造与封装技术分会会刊

功率器件封装纳米浆料材料与低温烧结工艺及机理研究进展^*

Advances in Nanopaste Materials and Low Temperature Sintering Process and Mechanism for Power Device Packaging

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