关键词: 人工智能, 集成电路, 生成式AI, 后摩尔, AI4Chip, 敏捷设计, 数字孪生

Abstract: Generative artificial intelligence (GenAI), along with its extension, Agentic AI, is driving a new, comprehensive technological and industrial transformation, coinciding with the integrated circuit (IC) industry facing many technical challenges and developmental bottlenecks in the post-Moore era. In terms of the three key elements—algorithm, data, and computing power—GenAI exhibits distinctive core characteristics which are different from other AI categories. GenAI is being applied in the IC field, encompassing paradigm shifts in two major domains—agilization of design and digital-twin of manufacturing—as well as innovations in auxiliary segments including EDA, IP cores, chiplets, equipment, and materials. The technological pathway—AI4Chip—is expected to be a critical driving force for sustaining the rapid development of IC in the post-Moore era.

Key words:

artificial intelligence, integrated circuits, generative AI, Post-Moore, AI4Chip, agile design, digital twin