中国电子学会电子制造与封装技术分会会刊

中国半导体行业协会封测分会会刊

无锡市集成电路学会会刊

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电子与封装 ›› 2026, Vol. 26 ›› Issue (4): 040302 . doi: 10.16257/j.cnki.1681-1070.2026.0035

• 电路与系统 • 上一篇    下一篇

基于SiP技术的电源防反器设计与实现

宋义雄1,2,王玉宝1,唐松章1,余铁鑫1,罗集睿1   

  1. 1.成都天奥电子股份有限公司,成都  610036; 2.西北工业大学机电学院,西安  710072
  • 收稿日期:2025-09-04 出版日期:2026-04-28 发布日期:2025-12-05
  • 作者简介:宋义雄(1989—),男,四川成都人,博士,工程师,现从事于功率半导体器件、MEMS传感器等领域高可靠封装技术研究。

Design and Implementation of Power Supply Reverse Polarity Protector Based on SiP Technology

SONG Yixiong1,2, WANG Yubao1, TANG Songzhang1, YU Tiexin1, LUO Jirui1   

  1. 1.   ChengduSpaceon Electronics Co., Ltd., Chengdu 610036, China; 2. School of Mechanical Engineering, Northwestern PolytechnicalUniversity, Xi’an 710072, China
  • Received:2025-09-04 Online:2026-04-28 Published:2025-12-05

摘要: 冷或门电源防反器是利用MOSFET设计制造的一种防止电源极性反接及电流倒灌的电源装置。其具有低导通压降、高电流承载能力、快速响应的特点,广泛应用于航空航天、便携式电子、工业设备、汽车电子等领域。目前市场上的MOSFET型电源防反器大部分采用板级封装工艺,存在导通电阻偏高,热耗和尺寸较大等问题。设计了一种基于系统级封装技术的封装结构,通过将功率芯片、控制芯片、无源器件集成在陶瓷壳体内,使得封装厚度减少24%,质量减少45%;通过优化互连工艺,以铜夹代替传统PCB引脚互连降低了导通电阻,高温工况下起始导通压降下降了43%,在长时间满负载情况下表现出良好的性能。

关键词: 系统级封装, 电源防反器, 铜夹互连

Abstract: The cold-oring reverse polarity protector is a power supply device utilizing MOSFETs to prevent power supply polarity reversal and current backflow. It has low forward voltage drop, high current carrying capacity, and rapid response, and is widely deployed in aerospace, portable electronics, industrial equipment, and automotive electronics. Most existing MOSFET-based protectors employ board-level packaging, suffering from high on-resistance, excessive thermal dissipation, and large dimensions. A system-in-package structure is proposed. By integrating power chips, control chip and passive components within a ceramic housing, the package thickness has been reduced by 24% and the mass by 45%. By optimizing the interconnect process and replacing traditional PCB pin interconnects with copper clamps, the on-resistance is reduced. It achieves a 43% decrease in initial forward voltage drop under high-temperature operation, with excellent performance during long-term full-load conditions.

Key words: system-in-package, power supply reverse polarity protector, copper clamp interconnect

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