关键词: 聚合物基电子封装材料, 热界面材料, 电磁屏蔽材料

Abstract: As integrated circuits enter the post-Moore’s Law era, with chip power density and signal frequencies continuing to rise, heat accumulation and electromagnetic interference (EMI) have become key bottlenecks limiting system performance and reliability. Against this backdrop, polymer-based electronic packaging materials, with their advantages of light weight, ease of processing, low cost, and excellent insulation properties, have emerged as one of the key material systems for developing highly efficient thermal management and electromagnetic interference shielding materials. A systematic review of the research progress and application challenges of polymer-based electronic packaging materials for thermal management and electromagnetic shielding is presented, with a focus on two key categories: thermal interface materials (TIMs) and electromagnetic interference shielding materials. A detailed analysis of the heat transfer mechanisms in thermal interface materials is presented, and the latest research on enhancing their thermal conductivity through strategies such as filler blending, orientation control, and three-dimensional structural design is summarized. In the section on EMI shielding materials, the fundamental theories of electromagnetic shielding are elucidated, including absorption, reflection, and multiple reflection mechanisms. It specifically reviews effective approaches to achieving “green” shielding with high absorption and low reflection by introducing magnetic fillers—such as ferrite and MXene composite magnetic materials—and through ingenious microstructural designs, such as gradient structures and porous networks.

Key words: polymer-based electronic packaging material, thermal interface material, electromagnetic shielding material