关键词: 微波产品, 焊点, 热应力, 失效模式, 可靠性

Abstract: Therewereplenty of methodsto connect leadsof microwavecomponentswith the circuit board,but soldering them directly on board was the best way for guaranting the microwave performances of products.However,inthismethod,thethermal stresswasonly setfreeby thedeformationof thesolder and thelead which were limited in a poor stress release capacity,generally leading to the crack of solder joints.To evaluate the stressrelease capacity of microwave productsjoints,threecommon typical failuremodesof high thermal stress solder joints were introduced,whose crack mechanisms were separately analyzed.The stress of solder joints was simulated through ANSYS software,which combined shift value of solder joints with the shearing deformation produced by it,to evaluate heat fatigue life of solder joints.The applicability and effectiveness of theseevaluationmethodswereverified.Finally,someoptimized processdesignmeasureswerepresented which werevery importantfor reliability improvementof solder joints.

Key words: microwaveproduct, solder joint, thermal stress, failuremode, reliability