中国半导体行业协会封装分会会刊

中国电子学会电子制造与封装技术分会会刊

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电子与封装 ›› 2019, Vol. 19 ›› Issue (6): 06 -8. doi: 10.16257/j.cnki.1681-1070.2019.0602

• 封装、组装与测试 • 上一篇    下一篇

基于LTCC 技术的加速度计制造方法

唐小平1,卢会湘1,严英占2   

  1. 1.中华华通河北分公司,石家庄 050081;2.中国电子科技集团公司第五十四研究所,石家庄 050081
  • 收稿日期:2019-03-14 出版日期:2019-06-19 发布日期:2019-06-19
  • 作者简介:唐小平(1982—),男,广西玉林人,学士,工程师,现主要从事微组装工艺研究工作。

Fabrication Method of Accelerometer Base on LTCC Technology

TANG Xiaoping1,LU Huixiang1,YAN Yingzhan2   

  1. 1.Hebei Far-East Communication System Engineering Co.Ltd.,Shijiazhuang 050081,China;2.China Electronics Technology Group Gorporation No.54 Research Institute,Shijiazhuang 050081,China
  • Received:2019-03-14 Online:2019-06-19 Published:2019-06-19

摘要: 低温共烧陶瓷(LTCC)技术是实现电子设备小型化、高密度集成化的主流技术手段,可适用于耐高温、耐受恶劣环境下的特性要求。介绍了LTCC 差分电容式加速度计结构,敏感质量块和4根悬臂梁结构都内嵌于LTCC 多层基板,质量块和上下电容板之间通过印刷电极组成差分电容对。重点讨论了微机械式LTCC 基加速度计的工艺制造方法及其面临的工艺问题,实现了多款内埋质量块结构的LTCC 电容式加速度计制造。

关键词: 低温共烧陶瓷, 加速度计, 微机械加工, 三维集成

Abstract: Low temperature co-fired ceramic (LTCC)technology is the mainstream technology to achieve miniaturization and high-density integration of electronic equipment.It is suitable for high temperature and severe environment.Differential capacitance accelerometers are introduced,which have four cantilever beams and a sensitive mass block embedded in the LTCC multilayer substrate.The differential capacitance pairs between the mass block and the upper and lower capacitor plates are composed by printed electrodes.The manufacturing difficulties and the fabrication methods for the micro-mechanical LTCC accelerometer are discussed,and the LTCC accelerometers with various structures are realized.

Key words: accelerometer, ceramic micromachining, three-dimensional integration, low temperature co-fired ceramic, accelerometer, ceramic micromachining, three-dimensional integration

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