关键词: 小型化, 一体化封装, 多芯片组装

Abstract: According to the miniaturization requirement of an amplitude modulator module, a miniaturization packaging structure is designed based on the integral substrate packaging technology. Shape and material characteristics of the structure are introduced in detail. This kind of packaging structure is used to miniaturized the amplitude modulator, as the size is changed from 91 mm×28 mm×8.5 mm to 20 mm×15 mm×7.6 mm, and the plane area is reduced about 88%. The miniaturization circuit is realized by common multi-chip module (MCM) technology and surface mount technology(SMT), which successfully achieve the purpose of miniaturization, because of the almost same parameters with themodulator.

Key words: miniaturization, integral substrate packaging, multi-chip module