关键词: 可焊性, BGA, 有铅, 无铅

Abstract: In orderto reduce the loss and recurrence difficulty as much as possible,itis necessary to do much experiments ortests to ensure the quality and reliability ofthe electronic components in military weapon system, especially before the whole system is completely loaded.Wetting Balance Testis an importantmethod used to judge the specifications such as the interface soldering properties and coplanarity properties.Itis very important to test the solderability of the electronic components for the detection and analysis department.The paper analyzes the problems occurred during the test of BGA device and provides some suggestions on Wetting Balance Testcovering standards and precautions.

Key words: Wetting Balance Test, BGA, leaded, lead-free