中国半导体行业协会封装分会会刊

中国电子学会电子制造与封装技术分会会刊

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电子与封装 ›› 2017, Vol. 17 ›› Issue (2): 40 -42. doi: 10.16257/j.cnki.1681-1070.2017.0025

• 微电子制造与可靠性 • 上一篇    下一篇

SADP工艺中一类特殊二维图形的分解处理

宋长庚   

  1. 上海交通大学,上海 200240
  • 收稿日期:2016-09-15 出版日期:2017-02-20 发布日期:2017-02-20
  • 作者简介:宋长庚(1984—),男,河北人,本科,从事NAND flash工艺整合研发工作。

Pattern Decomposition Method for Special 2D Pattern in SADP Process

SONG Changgeng   

  1. Shanghai Jiaotong University,Shanghai 200240,China
  • Received:2016-09-15 Online:2017-02-20 Published:2017-02-20

摘要: 自对准双重图型(SADP)技术广泛应用于28 nm以下节点逻辑电路制造工艺和存储器制造工艺。与其他双重图形技术(LELE,LPLE)相比,在处理二维图形分解时,SADP面临更复杂的要求。针对一种简单的二维图形,介绍了3种图形分解方法,可以有效改善线宽和对准工艺窗口。

关键词: 自对准双重图形, 二维图形, 图形分解, 工艺窗口

Abstract: Self-Aligned Double Patterning(SADP)has long been applied in advanced technologies beyond 28nm node,both logic and Memory.Compared to other double pattern technologies(LELE,LPLE),SADP faces a more complex problem of pattern decomposition when making 2D patterns.In the paper,3 kinds of layout decomposition methods are introduced for a simple 2D pattern.The methods effectively improves CD and OVL process window of the 1st and 2nd masks.

Key words: SADP, 2D pattern, layout decomposition, process window

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