关键词: 多芯片模块, 氮化铝陶瓷基板, 大功率开关

Abstract: Due to the strict requirements of high power，low insertion loss and high isolation，the paper makes a compromise of these parameters by selecting series/parallel circuits.Based on multi-chip module assembly technologies，the PIN diode chip is bonded on AlN ceramic substrate by highly conductive adhesive.Comparingwith conventional substrate materials，AlN has good thermal conductivity whicheliminatesthe heat sinkand reduces circuit size.The AlN-basedL-band power switch is capable of endure the pulse signal with 500 W peak power and 30%duty ratio and achieves 0.8 dB or less insertion loss and 35 dB or higher isolation.

Key words: multi-chip module, AlN ceramic substrate, power switch