关键词: SiC, 功率模块, 回流, 键合, 点胶, 灌胶

Abstract: SiC materials as the third generation of semiconductor materials, which with high junction temperature and the critical breakdown voltage, high heat conductivity, etc, is advantageous to realize the miniaturization of power module, and improve the high temperature performance of the powermodule. Based on this, make SiC hybrid power module with autonomous SiC diode which replace Si diode in order to achieve independent controllability. Key packaging process of hybrid power module is introduced in this paper, whichmainly contains reflow soldering,Al wire bonding, adhesive dispense, sealant pouring.

Key words: SiC, power module, reflow soldering, wire bonding, adhesive dispense, sealant pouring