微系统三维异质异构集成研究进展*

doi:10.16257/j.cnki.1681-1070.2021.1009

摘要/Abstract

摘要： 随着芯片应用的不断深入和产业化的不断发展，持续减小的特征尺寸使得摩尔定律的发展愈发困难，微系统已然成为电子技术的重要方向之一。三维异质异构集成着重于解决系统级的集成互连，其聚焦量级为亚微米至10 μm，并以较低的成本连通了从微纳连接到系统级集成的桥梁。微系统三维异质异构集成技术正在逐步向三维堆叠、多功能一体化、混合异构集成方向发展，这使得微系统具有集成度高、功耗小、微小型化、可靠性高等优点。对微系统三维异质异构集成的定位与发展形态、国内外研究现状、应用领域与应用前景等进行了综述。

关键词: 微系统, 三维异质异构集成, 电子封装, 可靠性

Abstract: With the continuous reduction of chip feature size, the continuation of Moore's Law becomes increasingly difficult, and microsystem has become one of the important orientations of electronic technology. 3D heterogeneous integration is the most optimal means for the microsystem to achieve the system function, performance, cycle and cost of integrated system. Focusing on the issues including system integration and interconnection in submicron to 10 μm orders of magnitude, 3D heterogeneous integration breaks the scale barrier from micro-nano technology to system integration at the acceptable cost. 3D heterogeneous integration of microsystem is gradually developing towards 3D stacking, multi-function integration and hybrid heterogeneous integration, which makes the microsystems have the advantages of high integration, low power consumption, miniaturization and high reliability. The scale positioning and development of 3D heterogeneous integration of microsystem, the current researches at home and abroad as well as the fields and prospects of application are summarized.

Key words: microsystem, 3Dheterogeneousintegration, electronicpackaging, reliability

中图分类号:

TN305.94

张墅野, 李振锋, 何鹏. 微系统三维异质异构集成研究进展*[J]. 电子与封装, 2021, 21(10): 100106 .

ZHANG Shuye, LI Zhenfeng, HE Peng. Progress on 3D Heterogeneous Integration of Microsystem[J]. Electronics & Packaging, 2021, 21(10): 100106 .

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