关键词: 去金, 搪锡, 镀金层, 焊接

Abstract: In order to improve the efficiency and guarantee the quality, this paper puts forward a solution to improve the efficiency of IC De-Golding in SOP package. The specific implementation method of the scheme is introduced, and the idea of dimension design of structural parts is given. The scheme is verified in production practice and compared with other methods to prove its reliability and practicability.

Key words: de-golding, tin-coating, gold-plated, soldering