关键词: CBGA陶瓷封装, 热膨胀系数, 失配, 先进互联焊柱, 高可靠

Abstract: With the widespread use of CBGA ceramic packaging devices in high reliability applications, the CTE mismatch problem caused by different thermal expansion coefficients between ceramics and epoxy resin circuit boards needs to be systematically solved. By analyzing the reliability improvement scheme, the method of changing the connection mode was selected. The three kinds of ceramic column-grid array solder columns, namely common high-lead solder column, spiral column and micro spring column, were simulated and tested. Their temperature and vibration reliability were compared and the micro spring column which can endure 500 cycles was selected, which provided reference for the high-reliability use of large-size CBGA packaging devices.

Key words: CBGA ceramic packaging, thermal expansion coefficient, mismatch, advanced interconnect solder pillar, reliability