关键词: 系统级封装, 三维堆叠, 宽带接收模块, 垂直互连, 高集成度

Abstract: To address the issues of large size and low space utilization in conventional two-dimensional system-in-package (SiP) receiver modules, a broadband receiver module based on three-dimensional stacked SiP technology is designed. By designing and optimizing the three-dimensional vertical interconnection circuits through simulation, and integrating this with the three-dimensional stacking packaging process of substrates and components, multifunctional circuits are vertically integrated. This approach significantly improves space utilization in the vertical dimension and greatly reduces the overall volume compared with traditional planar SiP receiver modules. Measurement results demonstrate that the proposed module operates over a frequency range covering the UHF, L, and partial S bands, achieving a receiving gain greater than 18 dB, in-band gain flatness of less than 2 dB, and a noise figure below 5 dB. The module supports functions including signal path switching, low-noise amplification, and detected voltage output. The overall size of the module is 16.0 mm×11.0 mm×3.8 mm, with a weight of only 2.5 g. It features compact size, light weight, and high integration, making it suitable for applications such as radar receiver front-end systems.

Key words: system-in-package, three-dimensional stacked, broadband receiver module, vertical interconnection, high integration