关键词: 三维集成, 射频系统, 无源电路, 垂直互连

Abstract: In the context of the continuous development of radio frequency (RF) systems, RF circuits have been widely used in the fields of mobile communication, satellite launch and industrial automation. However, with the progress of technology, the requirements for device performance are getting higher and higher, and the traditional circuit design can not meet the requirements of miniaturization, low loss and high integration. Therefore, as the core of three-dimensional (3D) integrated circuits, vertical interconnection technology has been widely used by researchers to integrate various RF circuit modules. This technology not only effectively reduces the occupied area of mobile communications and other fields, but also opens up new possibilities for its subsequent development. This review mainly introduces the research progress of passive circuits based on 3D integration, including 3D integrated filters, couplers, transformers and baluns. Finally, the development status and future development prospects of each passive circuit are summarized and prospected.

Key words: three-dimensional, integration, radio frequency, system