中国电子学会电子制造与封装技术分会会刊

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电子与封装

• 封装、组装与测试 •    下一篇

一种反熔丝FPGA的失效分析方法

孙贵涛,孙杰杰,隽扬,曹振吉,夏杰   

  1. 中国电子科技集团公司第五十八研究所,江苏 无锡  214035
  • 收稿日期:2026-06-15 修回日期:2026-07-29 出版日期:2026-08-04 发布日期:2026-08-04
  • 通讯作者: 孙贵涛

Failure Analysis of an Antifuse FPGA

SUN Guitao, SUN Jiejie, JUAN Yang, CAO Zhenji, XIA Jie   

  1. The 58th Institute of China Electronics Technology Group Corporation, Wuxi 214035, China
  • Received:2026-06-15 Revised:2026-07-29 Online:2026-08-04 Published:2026-08-04

摘要: 反熔丝FPGA是航天领域广泛使用的核心芯片,其失效分析的准确性直接关乎航天飞行器的安全。反熔丝FPGA是一次性可编程器件,不需要外部配置存储器,程序是烧录到反熔丝里的,无法进行在线调试,也无法使用类似SignalTAP之类的工具在线抓取信号波形,无法像SRAM型FPGA那样可以通过编写特点程序进行覆盖性测试,反熔丝FPGA的失效分析难度较大。本文针对某型反熔丝器件的故障问题,推测可能的原因,构建故障树,对疑点逐一排查,使用Flash Pro5配合上位机软件,将正常器件和异常器件的内部信号按照数据网表中的连接关系逐级引出观察,通过对比找到故障位置。然后通过FIB制样引入探针测试点,并通过Obirch测试点之间的电阻,再配合SEM电子显微镜扫描,逐层测试检查,并进行切片确认具体失效点和失效原因,最后进行失效机理分析验证分析的可靠性。

关键词: 反熔丝型FPGA, 失效分析, Flash Pro5, FIB 制样, Obirch测试, SEM检查

Abstract: Anti-fuse FPGAs are core chips widely used in the aerospace field, and the accuracy of their failure analysis is directly related to the safety of aerospace vehicles. Anti-fuse FPGA is a one-time programmable device. It does not require an external configuration memory, and the program is burned into the anti-fuse. Online debugging cannot be carried out, and it is also impossible to use tools like SignalTAP to capture signal wareforms online. This paper aims at the fault problem of a certain type of anti-fuse device, infers the possible causes, constructs a fault tree, and investigates the doubts one by one. Using Flash Pro5 combined with the upper computer software, leading out and observing the internal signals of the normal devices and abnormal devices step by step according to the connection relationship in the data netlist. By comparison, the fault location is founded. Then, test points are introduced by FIB sample Preparation, and the resistance between test points is tested by Obirch. Combined with SEM electrom microscope scanning, layer-by-layer test and inspection are carried out, and slicing is performed to confirm the specific failure point and failure cause. Finally, failure mechanism analysis is carried out to verify the reliability of the analysis. 

Key words: anti-fuse FPGA, failure analysis, Flash Pro5, FIB sample preparation, obirch test, SEM inspection