基于晶圆键合技术的传感器封装研究进展*

doi:10.16257/j.cnki.1681-1070.2025.0150

摘要/Abstract

摘要： 传感器作为信息感知的核心组件，对封装集成度与环境适应性有很高的要求。晶圆键合技术是晶圆级封装的关键技术，可以实现高气密性的可靠封装，已广泛应用于传感器制造领域。总结了多种适用于传感器封装的晶圆级键合技术，包括直接键合、阳极键合、玻璃熔块键合、金属键合和混合键合，分析了其技术原理、工艺特点、优势及在实际应用中的适用性，并探讨了相关应用场景。针对当前低温键合、异质集成、高密度互连及高可靠性封装的技术需求，对晶圆键合技术的未来发展趋势进行了展望。

关键词: 晶圆键合, 晶圆级封装, 传感器, 气密封装

Abstract: As the core component of information perception, sensors have high requirements for packaging integration and environmental adaptability. Wafer bonding technology is a key technology for wafer-level packaging, which can achieve packaging with high airtightness and has been widely used in the field of sensor manufacturing. A variety of wafer-level bonding technologies suitable for sensor packaging are summarized, including direct bonding, anodic bonding, glass melt bonding, metal bonding, and hybrid bonding. The technical principles, process characteristics, advantages, and the applicability in practical applications are analyzed, and the application scenarios are explored. In response to the current technological demands for low-temperature bonding, heterogeneous integration, high-density interconnection, and high reliability packaging, the future development trends of wafer bonding technology are discussed.

Key words: wafer bonding, wafer-level packaging, sensors, hermetic packaging

中图分类号:

TN305.94

贝成昊, 喻甜, 梁峻阁. 基于晶圆键合技术的传感器封装研究进展^*[J]. 电子与封装, 2025, 25(8): 080105 .

BEI Chenghao, YU Tian, LIANG Junge. Advances in Sensor Packaging Based on Wafer Bonding Technology[J]. Electronics & Packaging, 2025, 25(8): 080105 .

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中国半导体行业协会封装分会会刊

中国电子学会电子制造与封装技术分会会刊

基于晶圆键合技术的传感器封装研究进展^*

Advances in Sensor Packaging Based on Wafer Bonding Technology

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