多功能传感器集成综述

doi:10.16257/j.cnki.1681-1070.2023.0098

摘要/Abstract

摘要： 随着5G、智能汽车、物联网（IoT）、智慧医疗等市场的快速增长，其对传感器需求广泛，要求传感器具备微型化、集成化、智能化、低功耗等特点。概述了国内外学者在环境、汽车和生物参数检测等领域应用多功能传感器集成的成果，阐释了多功能传感器集成的工艺兼容性及封装的关键技术，分析了多功能传感器集成在模型仿真、产品测试和热管理方面面临的严峻挑战。对多功能传感器集成方案进行了总结，并提出了未来发展趋势。

关键词: 多功能传感器, 集成, MEMS-CMOS

Abstract: With the rapid growth of marks such as 5G, smart cars, internet of things (IoT) and smart healthcare,there is an extensive demands for sensors, requiring sensors to have characteristics such as miniaturization, integration, intelligenceand low power consumption. The results of domestic and international scholars in the application of multifunctional sensor integration in the fields of environmental, automotive and biological parameter detection are outlined,the key technologies of process compatibility and packaging for multifunctional sensor integration are explained,and the severe challenges of multifunctional sensor integration in terms of model simulation, product testing and thermal management are analyzed.The multifunction sensor integrationsolutions are summarized and the futuredevelopment trends are proposed.

Key words: multifunction sensors, integration, MEMS-CMOS

中图分类号:

TP273

吕佩珏, 黄哲, 王晓明, 杨知雨, 林晨希, 王铭强, 杨洋, 胡然, 苟秋, 李嘉怡, 金玉丰. 多功能传感器集成综述[J]. 电子与封装, 2023, 23(8): 080201 .

LYU Peijue, HUANG Zhe, WANG Xiaoming, YANG Zhiyu, LIN Chenxi, WANG Mingqiang, YANG Yang, HU Ran, GOU Qiu, LI Jiayi, JIN Yufeng. Review of Multifunction Sensor Integration[J]. Electronics & Packaging, 2023, 23(8): 080201 .

参考文献

[1] KOH W. System in package (SiP) technology applications[C]// 2005 6th International Conference on Electronic Packaging Technology, Shenzhen, China, 2005.
[2] TUMMALA R R, MADISETTI V K. System on chip or system on package?[J]. IEEE Design & Test of Computers, 1999, 16(2): 48-56.
[3] YU D. TSMC packaging technologies for chiplets and 3D[J]. Proceedings of the 2021 IEEE Hot Chips, 2021: 33.
[4] INGERLY D B, AMIN S, ARYASOMAYAJULA L, et al. Foveros: 3D integration and the use of face-to-face chip stacking for logic devices[C]// 2019 IEEE International Electron Devices Meeting (IEDM). San Francisco, CA, USA, 2019.
[5] LAU J H. 3D IC integration and 3D IC packaging[J]. Semiconductor Advanced Packaging, 2021: 343-378.
[6] ZHANG S, LI Z, ZHOU H, et al. Recent Prospectives and Challenges of 3D Heterogeneous Integration[J]. e-Prime-Advances in Electrical Engineering, Electronics and Energy, 2022: 100052.
[7] CHANG C C, HONG P H, YEH S K, et al. Environmental sensing hub on single chip using double-side post-CMOS processes[C]// 2020 IEEE 33rd International Conference on Micro Electro Mechanical Systems (MEMS), Vancouver, BC, Canada, 2020: 877-880.
[8] LIN Y C, HONG P H, YEH S K, et al. Monolithic integration of pressure/humidity/temperature sensors for CMOS-Mems environmental sensing hub with structure designs for performances enhancement[C]// 2020 IEEE 33rd International Conference on Micro Electro Mechanical Systems (MEMS), Vancouver, BC, Canada, 2020: 54-57.
[9] CHIEN T L, LEE Y C, CHOU T, et al. Fabrication and integration of SoC environment sensing hub with gas/pressure/temperature sensors[C]// 2022 IEEE 35th International Conference on Micro Electro Mechanical Systems Conference (MEMS), Shanghai, China, 2022: 138-141.
[10] IZHAR, XU W, TAVAKKOLI H, et al. Single-chip integration of CMOS compatible Mems temperature/humidity and highly sensitive flow sensors for human thermal comfort sensing application[C]// 2021 21st International Conference on Solid-State Sensors, Actuators and Microsystems (Transducers), Orlando, Florida, USA, 2021: 1219-1222.
[11] IZHAR, XU W, TAVAKKOLI H, et al. CMOS compatible MEMS multienvironmental sensor chip for human thermal comfort measurement in smart buildings[J]. IEEE Transactions on Electron Devices, 2022, 69(11): 6290-6297.
[12] ROOZEBOOM C L, HOPCROFT M A, SMITH W S, et al. Integrated multifunctional environmental sensors[J]. Journal of Microelectromechanical Systems, 2013, 22(3): 779-793.
[13] ROOZEBOOM C L, HILL B E, HONG V A, et al. Multifunctional integrated sensors for multiparameter monitoring applications[J]. Journal of Microelectromechanical Systems, 2015, 24(4): 810-821.
[14] MANSOOR M, HANEEF I, AKHTAR S, et al. SOI CMOS multi-sensors MEMS chip for aerospace applications[C]// IEEE Sensors, 2014: 1204-1207.
[15] MOHTASHIM M, IBRAHEEM H, SUHAIL A, et al. An SOI CMOS-based multi-sensor MEMS chip for fluidic applications[J]. Sensors, 2016, 16(11): 1608.
[16] UDREA F, LUCA A D. CMOS technology platform for ubiquitous microsensors[C]// 2017 International Semiconductor Conference (CAS), Sinaia, Romania, 2017: 43-52.
[17] UDREA F, GARDNER J W, SETIADI D, et al. Design and simulations of SOI CMOS micro-hotplate gas sensors[J]. Sensors and Actuators B: Chemical, 2001, 78(1-3): 180-190.
[18] UDREA F, SETIADI D, GARDNER J W, et al. A novel class of smart gas sensors using CMOS micro-heaters embedded in an SOI membrane[C]// Eurosensors XIV: The 14th European Conference on Solid-State Transducers, Copenhagen, Denmark, 2000: 391-392.
[19] UDREA F, GARDNER J W. Design of a silicon microsensor array device for gas analysis[J]. Microelectronics Journal, 1996, 27(6): 449-457.
[20] LUCA A D, HANEEF I, COULL J D, et al. High-sensitivity single thermopile SOI CMOS MEMS thermal wall shear stress sensor[J]. IEEE Sensors Journal, 2015, 15(10): 5561-5568.
[21] LUCA A D, LONGOBARDI G, UDREA F. SOI multidirectional thermoelectric flow sensor for harsh environment applications[C]// 2015 International Semiconductor Conference (CAS), Sinaia, Romania, 2015.
[22] LEE K W, NORIKI A, KIYOYAMA K, et al. Three-dimensional hybrid integration technology of CMOS, MEMS, and photonics circuits for optoelectronic heterogeneous integrated systems[J]. IEEE Transactions on Electron Devices, 2010, 58(3): 748-757.
[23] MA Q, WANG Z Y, PAN L Y. Monolithic integration of multiple sensors on a single silicon chip[C]// 2016 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP), Budapest, Hungary, 2016.
[24] K?CK A, WIMMER-TEUBENBACHER R, SOSADA-LUDWIKOVSKA F, et al. 3D-integrated multi-sensor demonstrator system for environmental monitoring[C]// 2019 20th International Conference on Solid-State Sensors, Actuators and Microsystems & Eurosensors XXXIII (TRANSDUCERS & EUROSENSORS XXXI), Berlin, Germany, 2019: 1136-1139.
[25] DONG J, LONG Z J, JIANG H, et al. Monolithic-integrated piezoresistive MEMS accelerometer pressure sensor with glass-silicon-glass sandwich structure[J]. Microsystem Technologies, 2017, 23(5): 1563-1574.
[26] WANG J C, XIA X Y, LI X X. Monolithic integration of pressure plus acceleration composite TPMS sensors with a single-sided micromachining technology[J]. Journal of Microelectromechanical Systems, 2011, 21(2): 284-293.
[27] WANG J C, LI X X. Package-friendly piezoresistive pressure sensors with on-chip integrated packaging-stress-suppressed suspension (PS3) technology[J]. Journal of Micromechanics and Microengineering, 2013, 23(4): 045027.
[28] XUE D, WANG J C, LI X X. Monothic Integration of Pressure Plus Z-Axis Acceleration Composite TPMs Sensors with 1.0mm×1.0mm Chip-Size and 0.09$/Die Fabrication-Cost[C]// 2020 IEEE 33rd International Conference on Micro Electro Mechanical Systems (MEMS), Vancouver, Canada, 2020: 1304-1307.
[29] BANERJEE N, BANERJEE A, HASAN N, et al. A Monolithically integrated multisensor platform[J]. IEEE Sensors Journal, 2016, 16(24): 8854-8860.
[30] MROSS S, ZIMMERMANN T, WINKIN N, et al. Integrated multi-sensor system for parallel in-situ monitoring of cell nutrients, metabolites and cell mass in biotechnological processes[J]. Procedia engineering, 2015, 120: 372-375.
[31] B?CKER M, POUYESHMAN S, SCHNITZLER T, et al. A silicon‐based multi‐sensor chip for monitoring of fermentation processes[J]. Physica Status Solidi (a), 2011, 208(6): 1364-1369.
[32] RUSLI N I, VINCENTINI I P, CEYSSENS F, et al. Multi-sensor chip for monitoring key parameters in bioprocesses[J]. IEEE Sensors Journal, 2021, 21(18): 19675-19683.
[33] ARTMANN H, SCHAEFER F, LAMMEL G, et al. Monocrystalline Si membranes for pressure sensors fabricated by a novel surface micromachining process using porous silicon[J]// MEMS Components and Applications for Industry, Automobiles, Aerospace, and Communication II, 2003, 4981: 65-70.
[34] KNESE K, ARMBRUSTER S, WEBER H, et al. Novel technology for capacitive pressure sensors with monocrystalline silicon membranes[C]// 2009 IEEE 22nd International Conference on Micro Electro Mechanical Systems, Sorrento, Italy, 2009: 697-700.
[35] LAMMEL G, ARMBRUSTER S, SCHELLING C, et al. Next generation pressure sensors in surface micromachining technology[C]// The 13th International Conference on Solid-State Sensors, Actuators and Microsystems, Seoul, Korea, 2005.
[36] YLIMAULA M, ABERG M, KIIHAMAKI J, et al. Monolithic SOI-MEMS capacitive pressure sensor with standard bulk CMOS readout circuit[C]// ESSCIRC 2004-29th European Solid-State Circuits Conference (IEEE Cat. No. 03EX705), Estoril, Portugal, 2003: 611-614.
[37] HIEROLD C. Intelligent CMOS sensors[C]//Proceedings IEEE Thirteenth Annual International Conference on Micro Electro Mechanical Systems, Miyazaki, Japan, 2000, 23-27: 1-6.
[38] QU H W. CMOS MEMS fabrication technologies and devices[J]. Micromachines, 2016, 7(1): 14.
[39] ZHANG Y X, YANG C C, MENG F R, et al. A monolithic integration multifunctional MEMS sensor based on cavity SOI wafer[J]//IEEE Sensors, 2014: 1952-1955.
[40] NIKLAUS F, FISCHER A C. Heterogeneous 3D integration of MOEMS and ICs[J]// International Conference on Optical MEMS and Nanophotonics, 2016: 1-2.
[41] LEE C Y, CHEN C H, HSIEH C L, et al. Flexible, multifunctional micro-sensor applied to internal measurement and diagnosis of vanadium flow battery[J]. Micromachines, 2022, 13(8): 1193.
[42] LUPI C, FELLI F, LPOPOLITI L, et al. Metal coating for enhancing the sensitivity of fiber Bragg grating sensors at cryogenic temperature[J]. Smart Materials and Structures, 2005, 14(6): 71-76.
[43] DONG Z Q, CHEN J J, QIN Y K, et al. Fabrication of a micromachined two-dimensional wind sensor by Au–Au wafer bonding technology[J]. Journal of microelectromechanical systems, 2012, 21(2): 467-475.

中国半导体行业协会封装分会会刊

中国电子学会电子制造与封装技术分会会刊