关键词: 硅通孔, 倒装芯片, 芯片叠层, 高效散热, 高密度组装

Abstract: System in package (SiP) and microsystem technologies can achieve higher density and more functional integration in limited space, and they are the key technologies to meet the requirements of miniaturization, high performance and high reliability of electronic devices in high-end fields such as aerospace, weapons and equipment. The assembly and packaging technology of high density modules, such as reverse welding three-dimensional assembly and process quality control based on through silicon via (TSV) interposer, chip lamination based on bonding process, double channel heat dissipation package based on reverse welding, are discussed. Meanwhile, the modular and integrated scheme of multi-flip-chip using TSV interposer is studied. Based on the above technologies, the high density and air tight packaging of information processing SiP module and the double-sided three-chamber microsystem module packaging, which meets the requirements of heat dissipation of multi-flip-chip and daylighting of CMOS image sensor (CIS), are realized.

Key words: through silicon via, flip-chip, chip stacking, efficient heat dissipation, high density assembly