铜线键合模式和塑封料对QFN封装可靠性的影响

doi:10.16257/j.cnki.1681-1070.2025.0025

摘要/Abstract

摘要： 键合工艺和塑封料对芯片封装可靠性至关重要。为了研究键合模式和塑封料对芯片封装可靠性的影响，以K&S公司的RAPID焊线机为键合工艺平台，以40 nm CMOS工艺的QFN封装芯片为研究对象，分别使用FSF键合模式和FSFF键合模式进行键合实验。使用不同塑封料塑封键合后样品，并对塑封后样品进行MSL3、TCT、UHAST、BHAST、HTOL、HTST等可靠性实验，利用SEM和EDS对键合后焊球形态和可靠性失效样品进行分析。结果表明，键合模式对BHAST可靠性影响较大，塑封料对BHAST可靠性影响较小，为实际生产中键合工艺的选择提供了理论基础和实践指导。

关键词: 半导体封装, 键合模式, 焊球形态, 封装可靠性, 失效分析

Abstract: Bonding process and molding compounds are critical to chip package reliability. In order to study the effects of bonding modes and molding compounds on the reliability of chip package, K&S RAPID wire bonding machine is used as the bonding process platform, QFN packaged chips with 40 nm CMOS process are used as the research object, and bonding experiments are conducted using FSF bonding mode and FSFF bonding mode respectively. The bonded samples are molded with different molding compounds, reliability tests such as MSL3, TCT, UHAST, BHAST, HTOL and HTST are performed on the molded samples, and the morphology of the solder balls and reliability failure samples after bonding are analyzed by SEM and EDS. The results show that the bonding modes have a greater impact on the reliability of BHAST, and the molding compounds have a lesser impact on the reliability of BHAST, which provide theoretical basis and practical guidance for the selection of bonding process in actual production.

Key words: semiconductor package, bonding mode, solder ball morphology, package reliability, failure analysis?

中图分类号:

TN305.94

王宝帅,高瑞婷,张铃,梁栋,欧阳毅. 铜线键合模式和塑封料对QFN封装可靠性的影响[J]. 电子与封装, 2025, 25(2): 020204 .

WANG Baoshuai, GAO Ruiting, ZHANG Ling, LIANG Dong, OUYANG Yi. Effect of Wire Bonding Modes and Molding Compounds on QFN Package Reliability[J]. Electronics & Packaging, 2025, 25(2): 020204 .

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中国半导体行业协会封装分会会刊

中国电子学会电子制造与封装技术分会会刊